相关论文: High-NA In-Line Projector for EUV Lithography
This paper discusses a simple, low-cost, highly efficient two-mirror projector with a simplified illumination system. The EUV source power can be reduced by 1/10 compared to the current six-mirror EUV projector system. The required EUV…
Plane-parallel resonator configuration is proposed for high-NA EUV lithography, where the lithography mask and the wafer are parallelly arranged through two focusing mirrors. EUV light is injected through an off-axis rotating mirror at the…
Using the illuminator for high numerical aperture (NA) extreme ultraviolet (EUV) exposure tool in EUV lithography can lead to support volume production of sub-2 nm logic nodes and leading-edge DRAM nodes. However, the typical design method…
Extreme ultraviolet (EUV) lithography is the cornerstone of the fabrication of advanced integrated circuits at the 7-nm node and beyond, but its reliance on multi-element reflective projection optics makes it inaccessible for small-scale…
Mask-based pattern generation is a crucial step in microchip production. The next-generation extreme-ultraviolet- (EUV) lithography instruments with a wavelength of \SI{13.5}{\nano\meter} is currently under development. In principle, this…
In optical imaging, achieving high resolution often comes at the expense of a shallow depth of field. This means that when using a standard microscope, any minor movement of the object along the optical axis can cause the image to become…
Extreme ultraviolet (EUV) lithography is the leading lithography technique in CMOS mass production, moving towards the sub-10 nm half-pitch (HP) regime with the ongoing development of the next generation high-numerical aperture (high-NA)…
The absence of efficient light modulators for extreme ultraviolet (EUV) and X-ray photons significantly limits their real-life application, particularly when even slight complexity of the beam patterns is required. Here we report on a novel…
A refined model of an extreme ultraviolet (EUV) mask stack consisting of the Mo/Si multilayer coated by a Ru protective layer and a TaBN/TaBO absorber layer was developed to facilitate accurate simulations of EUV mask performance for…
In the past years, EUV lithography scanner systems have entered High-Volume Manufacturing for state-of-the-art Integrated Circuits (IC), with critical dimensions down to 10 nm. This technology uses 13.5 nm EUV radiation, which is shaped and…
We adapted a conventional microscope for projection photolithography using an ultraviolet (UV) light-emitting diode (LED) as a light source. The use of a UV LED provides the microscope projector with several advantages in terms of…
Light-matter interactions in the deep ultraviolet (DUV) wavelength region exhibits a variety of optical effects such as luminescence, photoisomerization, and polymerization in many materials. Despite the rich photochemistry and high spatial…
Microscopy with extreme ultraviolet (EUV) radiation holds promise for high-resolution imaging with excellent material contrast, due to the short wavelength and numerous element-specific absorption edges available in this spectral range. At…
High-resolution lithographic techniques are often limited by low volumetric throughput, since there is no universal and scalable manufacturing process that can produce 3D metasurfaces. In this work, we demonstrate a high-speed holographic…
Simulations of light scattering off an extreme ultraviolet lithography mask with a 2D-periodic absorber pattern are presented. In a detailed convergence study it is shown that accurate results can be attained for relatively large 3D…
A critical technology for high-volume manufacturing of nanoscale integrated circuits is a high-power extreme ultraviolet (EUV) light source. Over the past decades, laser-produced plasma (LPP) sources have been actively utilized in this…
We present a maskless microscope projection lithography system (MPLS), in which photomasks have been replaced by a Digital Micromirror Device type spatial light modulator (DMD, Texas Instruments). Employing video projector technology high…
The possibility to obtain a three-dimensional representation of a single object with sub-$\mu$m resolution is crucial in many fields, from material science to clinical diagnostics. This is typically achieved through tomography, which…
In this paper, a method for solving the initial structure of an off-axis multi-mirror system applied to extreme ultraviolet (EUV) lithography using a paraxial ray-tracing algorithm based on Seidel aberration theory is proposed. By tracing…
Micro lens array is crucial in various kinds of optical and electronic applications. A micro lens array with high numerical aperture (NA) and low aberration is in particular needed. This research is aimed to design and fabricate such a…