相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
The spatially precise integration of arrays of micro-patterned two-dimensional (2D) crystals onto three-dimensionally structured Si/SiO$_2$ substrates represents an attractive strategy towards the low-cost system-on-chip integration of…
Feasibility of the promising large intelligent surface (LIS) concept, as well as its scalability, relies on the use of low-cost hardware components, raising concerns about the effects of hardware distortion. We analyze LIS systems with…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…
Routine applications of electronic structure theory to molecules and periodic systems need to compute the electron density from given Hamiltonian and, in case of non-orthogonal basis sets, overlap matrices. System sizes can range from few…
Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Study of the dephasing in electronic systems is not only important for probing the nature of their ground states, but also crucial to harnessing the quantum coherence for information processing. In contrast to well-studied conventional…
High quality micro- and nano-mechanical resonators are widely used in sensing, communications and timing, and have future applications in quantum technologies and fundamental studies of quantum physics. Crystalline thin-films are…
In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
Two-dimensional (2D) topological insulators (TIs), a new state of quantum matter, are promising for achieving the low-power-consuming electronic devices owning to the remarkable robustness of their conducting edge states against…
Device passivation through ultraclean hexagonal BN encapsulation is proven one of the most effective ways for constructing high-quality devices with atomically thin semiconductors that preserves the ultraclean interface quality and…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
We study the problem of exact support recovery for high-dimensional sparse linear regression under independent Gaussian design when the signals are weak, rare, and possibly heterogeneous. Under a suitable scaling of the sample size and…
Integrated circuits and electronic systems, as well as design technologies, are evolving at a great rate -- both quantitatively and qualitatively. Major developments include new interconnects and switching devices with atomic-scale…
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…
3D Gaussian Splatting (3DGS) has recently created impressive 3D assets for various applications. However, considering security, capacity, invisibility, and training efficiency, the copyright of 3DGS assets is not well protected as existing…