相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm x 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without the need…
Two-dimensional (2D) materials with extraordinary electrical properties, hold promising for large-scale, flexible electronics. However, their device performance could be hindered due to the excessive defects introduced via traditional…
An Intrusion Detection System (IDS) aims to alert users of incoming attacks by deploying a detector that monitors network traffic continuously. As an effort to increase detection capabilities, a set of independent IDS detectors typically…
It is well known that $\ell_1$ minimization can be used to recover sufficiently sparse unknown signals from compressed linear measurements. In fact, exact thresholds on the sparsity, as a function of the ratio between the system dimensions,…
Self-supervised learning (SSL) has transformed representation learning for large models, yet remains unexplored for microcontroller (MCU)-class models with fewer than 500K parameters. We identify three obstacles at this scale -- projection…
Downlink channel estimation with low pilot overhead is an important and challenging problem in large-scale MIMO systems due to the substantially increased MIMO channel dimension. In this letter, we propose a block iterative support…
Metamaterials and metasurfaces have given possibilities for manipulating electromagnetic (EM) waves that in the past would have seemed impossible. The majority of metasurface designs are suitable for a particular frequency and angle of…
There is a growing call for greater amounts of increasingly agile computational power for edge and cloud infrastructure to serve the computationally complex needs of ubiquitous computing devices. Thus, an important challenge is addressing…
While 2D materials have enormous potential for future device technologies, many challenges must be overcome before they can be deployed at an industrial scale. One of these challenges is identifying the right semiconductor/insulator…
The measurement and analysis of Electrodermal Activity (EDA) offers applications in diverse areas ranging from market research, to seizure detection, to human stress analysis. Unfortunately, the analysis of EDA signals is made difficult by…
Lightweight block ciphers have been widely used in applications such as RFID tags, IoTs, and network sensors. Among them, with comparable parameters, the Light Encryption Device (LED) block cipher achieves the smallest area. However,…
Identifying and removing microplastics (MPs) from the environment is a global challenge. This study explores how the colloidal fraction of common MPs behave at aqueous interfaces of liquid crystal (LC) films. We observed polyethylene (PE)…
As the core determinant of lithium-ion battery performance, electrode materials play a crucial role in defining the battery's capacity, cycling stability, and durability. During charging and discharging, electrode materials undergo complex…
Industrial Edge AI programs often begin with the model and only later confront the platform. That sequencing is attractive because it allows early demonstrations, but it breaks down when the deployment target is an embedded system with long…
Integrated sensing and communication (ISAC) is envisioned be to one of the paradigms upon which next-generation mobile networks will be built, extending localization and tracking capabilities, as well as giving birth to environment-aware…
The physical size of optical imaging systems is one of the greatest constraints on their use, limiting the performance and deployment of a range of systems from telescopes to mobile phone cameras. Spaceplates are nonlocal optical devices…
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$…
Overcoming the limitations of current nanofabrication techniques to achieve nanoscale feature sizes is essential for achieving new regimes of light-matter interactions at extreme frequencies and length scales. Here, we demonstrate a…
The complexity of modern integrated circuits (ICs) necessitates collaboration between multiple distrusting parties, including thirdparty intellectual property (3PIP) vendors, design houses, CAD/EDA tool vendors, and foundries, which…
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to…