相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
Optical metasurfaces performing analog image processing - such as spatial differentiation and edge detection - hold the potential to reduce processing times and power consumption, while avoiding bulky 4F lens systems. However, current…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Elliptic partial differential equations (PDEs) frequently arise in continuum descriptions of physical processes relevant to science and engineering. Multilevel preconditioners represent a family of scalable techniques for solving discrete…
Exascale computing promises quantities of data too large to efficiently store and transfer across networks in order to be able to analyze and visualize the results. We investigate Compressive Sensing (CS) as a way to reduce the size of the…
Micromechanical constitutive parameters are important for many engineering materials, typically in microelectronic applications and material design. Their accurate identification poses a three-fold experimental challenge: (i) deformation of…
Electronic textiles (E-textiles) offer great wearing comfort and unobtrusiveness, thus holding potential for next-generation health monitoring wearables. However, the practical implementation is hampered by challenges associated with poor…
We present a 3D-printing-based design to produce wire-guided liquid microfilms that can be used for versatile spectroscopic applications. We demonstrate the ability of our instrument to provide optically useful liquid microfilms with highly…
Three-dimensional electron diffraction (3DED) is a powerful technique providing for crystal structure solutions of sub-micron sized crystals too small for structure determination via X-ray techniques. The entry requirement, however, of a…
The integrating sphere (IS) is an indispensable tool for measuring transmission and scattering of materials and their colorimetry, as well as other photometric tasks. The accuracy of its data depends critically on port sizes used for…
Self-supervised learning (SSL) has emerged as a powerful strategy for representation learning under limited annotation regimes, yet its effectiveness remains highly sensitive to many factors, especially the nature of the target task. In…
Open-set 3D segmentation represents a major point of interest for multiple downstream robotics and augmented/virtual reality applications. We present a decoupled 3D segmentation pipeline to ensure modularity and adaptability to novel 3D…
Droplet-confined electrodeposition enables a precise deposition of three dimensional, nanoscopic and high purity metal structures. It aspires to fabricate intricate microelectronic devices, metamaterials, plasmonic structures and…
Three dimensional electron back-scattered diffraction (EBSD) microscopy is a critical tool in many applications in materials science, yet its data quality can fluctuate greatly during the arduous collection process, particularly via…
High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is…
Passive object sensing with communication signals is a key enabler of perceptive mobile networks and integrated sensing and communication. In practical bistatic deployments, transmitter-receiver asynchrony and hardware impairments introduce…
A previously developed modeling procedure for large eddy simulations (LESs) is extended to allow physical space implementations for inhomogeneous flows. The method is inspired by the well-established theoretical analyses and numerical…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…
Accurate and low-overhead channel state information (CSI) feedback is essential to boost the capacity of frequency division duplex (FDD) massive multiple-input multiple-output (MIMO) systems. Deep learning-based CSI feedback significantly…