相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
The scientific interest in two-dimensional topological insulators (2D TIs) is currently shifting from a more fundamental perspective to the exploration and design of novel functionalities. Key concepts for the use of 2D TIs in spintronics…
Modern scientific instruments operate under increasingly extreme constraints on bandwidth, latency, and power. Inference at the sensor edge determines experimental data collection efficiency by deciding which information to save for further…
Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools…
The next generation of soft electronics will expand to the third dimension. This will require the integration of mechanically-compliant three-dimensional functional structures with stretchable materials. This study demonstrates…
Supercomputers getting ever larger and energy-efficient is at odds with the reliability of the used hardware. Thus, the time intervals between component failures are decreasing. Contrarily, the latencies for individual operations of…
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
Infrared small target detection (ISTD) plays a critical role in a wide range of civilian and military applications. Existing methods suffer from deficiencies in the localization of dim targets and the perception of contour information under…
Microfabricated surface-electrode traps are a scalable platform for trapped-ion quantum processors. Recent advances in fabrication techniques have enabled the design of increasingly complex multi-layer structures. Yet the control electrodes…
Industry-scale recommender systems face a core challenge: representing entities with high cardinality, such as users or items, using dense embeddings that must be accessible during both training and inference. However, as embedding sizes…
Scaling trapped-ion quantum computing will require robust trapping of at least hundreds of ions over long periods, while increasing the complexity and functionality of the trap itself. Symmetric 3D structures enable high trap depth, but…
Miniaturization of light-emitting diodes (LEDs) can enable high-resolution augmented and virtual reality displays and on-chip light sources for ultra-broadband chiplet communication. However, unlike silicon scaling in electronic integrated…
Existing high-end embedded systems face frequent security attacks. Software compartmentalization is one technique to limit the attacks' effects to the compromised compartment and not the entire system. Unfortunately, the existing…
We analyze a novel architecture for caching popular video content to enable wireless device-to-device collaboration. We focus on the asymptotic scaling characteristics and show how they depends on video content popularity statistics. We…
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…
Future distribution systems are expected to display increased complexity, mainly due to looped/meshed operation, switch between grid-connected and islanded mode and considerable integration of distributed generation. This paper investigates…
Most chip designers outsource the manufacturing of their integrated circuits (ICs) to external foundries due to the exorbitant cost and complexity of the process. This involvement of untrustworthy, external entities opens the door to major…
We challenge the current thinking and approach to the design of photonic integrated circuits (PICs) for applications in communications, quantum information and sensing. The standard PICs are based on directional couplers, that provide a…
Edge computing is projected to have profound implications in the coming decades, proposed to provide solutions for applications such as augmented reality, predictive functionalities, and collaborative Cyber-Physical Systems (CPS). For such…
A key component for optical on-chip communication is an efficient light source. However, to enable low energy per bit communication and local integration with Si CMOS, devices need to be further scaled down. In this work, we fabricate…