相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
Modern electronic systems become evermore complex, yet remain modular, with integrated circuits (ICs) acting as versatile hardware components at their heart. Electronic design automation (EDA) for ICs has focused traditionally on power,…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
Single-photon emitters are essential building blocks for quantum communication and photonic quantum technologies. However, realizing scalable, on-chip SPEs on a CMOS-compatible platform remains a significant challenge. Here, we propose and…
Human-like embodied tactile perception is crucial for the next-generation intelligent robotics. Achieving large-area, full-body soft coverage with high sensitivity and rapid response, akin to human skin, remains a formidable challenge due…
A key benefit of photonic crystal surface emitting lasers (PCSELs) is the abillity to increase output power through scaling the emission area while mainting high quality single mode emission, allowing them to close the brightness gap which…
Characterizing long-range electric fields and built-in potentials in functional materials at nano- to micrometer scales is of supreme importance for optimizing devices. E.g., the functionality of semiconductor heterostructures or battery…
The mechanical response of interpenetrating phase composites (IPCs) with stochastic spinodal topologies is investigated experimentally and numerically. Model polymeric systems are fabricated by Polyjet multi-material printing, with the…
Recent advances in quantum information processing with trapped ions have demonstrated the need for new ion trap architectures capable of holding and manipulating chains of many (>10) ions. Here we present the design and detailed…
We consider the thermodynamics of a uniformly charged polyelectrolyte with harmonic bonds. For such a system there is at high temperatures an approximate scaling of global properties like the end-to-end distance and the interaction energy…
Miniatured computational spectrometers, distinguished by their compact size and lightweight, have shown great promise for on-chip and portable applications in the fields of healthcare, environmental monitoring, food safety, and industrial…
The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising…
Microwave sensors integrated with microfluidic platforms can provide the size and permittivity of single cells and microparticles. Amongst the microwave sensor topologies, the planar arrangement of electrodes is a popular choice owing to…
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out…
Reliability has emerged as a key topic of interest for researchers around the world to detect and/or mitigate the side effects of decreasing transistor sizes, such as soft errors. Traditional solutions, like DMR and TMR, incur significant…
Pixelated detectors in scanning transmission electron microscopy (STEM) generate large volumes of data, often tens to hundreds of GB per scan. However, to make current advancements scalable and enable widespread adoption, it is essential to…
Future wireless networks must serve dense mobile networks with high data rates, keeping energy requirements to a possible minimum. The small cell-based network architecture and device-to-device (D2D) communication are already being…
Compressed sensing (CS) is an innovative technique allowing to represent signals through a small number of their linear projections. Hence, CS can be thought of as a natural candidate for acquisition of multidimensional signals, as the…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…