相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries.…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
Downsampling images and labels, often necessitated by limited resources or to expedite network training, leads to the loss of small objects and thin boundaries. This undermines the segmentation network's capacity to interpret images…
Three-dimensional (3D) photonic integrated circuits (PIC) are emerging as an indispensable scheme for high density and multifunctional photonic systems. However, the wafer-scale scaling of PICs towards a 3D configuration is constrained by…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…
Transistor miniaturization requires controlling gate leakage through ultrathin dielectrics and minimizing source/drain contact resistance. Although two-dimensional (2D) semiconductors offer excellent electrostatic control, their interfaces…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Photonic integrated circuits (PICs) enable miniaturization of optical quantum circuits because several optic and electronic functionalities can be added on the same chip. Single photon emitters (SPEs) are central building blocks for such…
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substrates are used to implement the inter-chiplet…
The rapid adoption of chiplet-based heterogeneous integration is reshaping semiconductor design by enabling modular, scalable, and faster time-to-market solutions for AI and high-performance computing. However, multi-vendor assembly in…
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics…
Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…
We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…
Leveraging 2.5D interposer technology, we advocate the integration of untrusted commodity components/chiplets with physically separate, entrusted logic components. Such organization provides a modern root of trust for secure system-level…
CMOS pixel sensors with a small collection electrode combine the advantages of a small sensor capacitance with the advantages of a fully monolithic design. The small sensor capacitance results in a large ratio of signal-to-noise and a low…
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable…
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet interconnect (ICI). The ICI design space is huge as there are…
We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…