相关论文: Tiny Chiplets Enabled by Packaging Scaling: Opport…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more…
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…
Advanced 2.5D Systems-in-Package (SiPs) compose a growing portion of high-performance systems. While the packaging and interconnect choices play a large role in the overall system design, system architects still lack a suitable framework…
Interconnected embedded devices are increasingly used invarious scenarios, including industrial control, building automation, or emergency communication. As these systems commonly process sensitive information or perform safety critical…
Industry adoption of chiplets has been growing as chiplets are a cost-effective option for making large, high-performance systems. Consequently, partitioning large systems into chiplets is increasingly important. In this work, we introduce…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
Topological Insulators (TIs) present an interesting materials platform for nanoscale, high frequency devices because they support high mobility, low scattering electronic transport within confined surface states. However, a robust…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
Millimeter-scale embedded sensing systems have unique advantages over larger devices as they are able to capture, analyze, store, and transmit data at the source while being unobtrusive and covert. However, area-constrained systems pose…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
This technical article explores comprehensive strategies for integrating Electrostatic Discharge (ESD) protection diodes and termination resistors in LowVoltage Differential Signaling (LVDS) designs. The article examines critical aspects of…