相关论文: US Microelectronics Packaging Ecosystem: Challenge…
The idea of changing our energy system from a hierarchical design into a set of nearly independent microgrids becomes feasible with the availability of small renewable energy generators. The smart microgrid concept comes with several…
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and development nowadays is the integration of sensors and micromechanical…
Embedding artificial intelligence into systems introduces significant challenges to modern engineering practices. Hazard analysis tools and processes have not yet been adequately adapted to the new paradigm. This paper describes initial…
The optimization of large experiments in fundamental science, such as detectors for subnuclear physics at particle colliders, shares with the optimization of complex systems for industrial or societal applications the common issue of…
Spectrum manipulation is central to photonic systems, where advanced computing and sensing applications often demand highly complex spectral responses to achieve high throughput. Conventional methods for enhancing spectral complexity…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…
Enabling perfect light absorption in ultrathin materials promises the development of exotic photonic devices. Here we demonstrate new strategies that can provide capabilities to rationally design ultrathin (thickness <…
Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation…
Computing systems are tightly integrated today into our professional, social, and private lives. An important consequence of this growing ubiquity of computing is that it can have significant ethical implications of which computing…
Pushed by market forces, software development has become fast-paced. As a consequence, modern development projects are assembled from 3rd-party components. Security & privacy assurance techniques once designed for large, controlled updates…
Traceability systems have become prevalent in supply chains because of the rapid development of RFID and IoT technologies. These systems facilitate product recall and mitigate problems such as counterfeiting, tampering, and theft by…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
Photolithography is typically the bottleneck process in semiconductor manufacturing. In this paper, we present a model for optimizing the scheduling of the photolithography process in the presence of both individual and cluster tools. The…
The introduction of complex SoCs with multiple processor cores presents new development challenges, such that development support is now a decisive factor when choosing a System-on-Chip (SoC). The presented developments support strategy…
The multidisciplinarity of robotics creates a need for robust integration methodologies that can facilitate the adoption of state-of-the-art research components in an industrial application. Unfortunately, there are no clear, community…
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…
With the proliferation of IoT and edge devices, we are observing a lot of consumer electronics becoming yet another IoT and edge devices. Unlike traditional smart devices, such as smart phones, consumer electronics, in general, have…
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable…