相关论文: US Microelectronics Packaging Ecosystem: Challenge…
The automotive industry is currently undergoing a major transformation with respect to the Electric/Electronic (E/E) and software architecture, driven by a significant increase in the complexity of the technological stack within a vehicle.…
The semiconductor industry is pivotal to Europe's economy, especially within the industrial and automotive sectors. However, Europe faces a significant shortfall in chip design capabilities, marked by a severe skilled labor shortage and…
This research highlights the rapid development of technology in the industry, particularly Industry 4.0, supported by fundamental technologies such as the Internet of Things (IoT), cloud computing, big data, and data analysis. Despite…
As AI adoption expands across human society, the problem of aligning AI models to match human preferences remains a grand challenge. Currently, the AI alignment field is deeply divided between behavioral and representational approaches,…
Analog mixed-signal (AMS) circuit architecture has evolved towards more digital friendly due to technology scaling and demand for higher flexibility/reconfigurability. Meanwhile, the design complexity and cost of AMS circuits has…
The software engineering research community is productive, yet it faces a constellation of challenges: swamped review processes, metric-driven incentives, distorted publication practices, and increasing pressures from AI, scale, and…
This article delves into the strategic approaches and preventive measures necessary to safeguard the software supply chain against evolving threats. It aims to foster an understanding of the challenges and vulnerabilities inherent in…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in how computer systems are designed, implemented, scaled, and used. Since Moores Law,…
The contemporary era is marked by rapid urban growth and increasing population. A significant, and constantly growing, portion of the global population now resides in major cities, leading to escalating energy demands in urban centers. As…
Modern scientific instruments operate under increasingly extreme constraints on bandwidth, latency, and power. Inference at the sensor edge determines experimental data collection efficiency by deciding which information to save for further…
This white paper suggests posing a "grand challenge" to the HEP instrumentation community, i.e. the aggressive development of additive manufacturing, also known as 3D-printing, for the production of particle detectors in collaboration with…
Manufacturing companies face challenges when it comes to quickly adapting their production control to fluctuating demands or changing requirements. Control approaches that encapsulate production functions as services have shown to be…
Researchers have long touted a vision of the future enabled by a proliferation of internet-of-things devices, including smart sensors, homes, and cities. Increasingly, embedding intelligence in such devices involves the use of deep neural…
In order to take full advantage of the U.S. Department of Energy's billion-dollar investments into the next-generation research infrastructure (e.g., exascale, light sources, colliders), advances are required not only in detector technology…
Printed electronics have gained significant traction in recent years, presenting a viable path to integrating computing into everyday items, from disposable products to low-cost healthcare. However, the adoption of computing in these…
Computing systems have undergone several inflexion points - while Moore's law guided the semiconductor industry to cram more and more transistors and logic into the same volume, the limits of instruction-level parallelism (ILP) and the end…
Resource-constrained embedded and mobile devices are becoming increasingly common. Since few years, some mobile and ubiquitous devices such as wireless sensor, able to be aware of their physical environment, appeared. Such devices enable…
The ability to independently deploy parts of a software system is one of the cornerstones of modern software development, and allows for these parts to evolve independently and at different speeds. A major challenge of such independent…
In today's integrated circuit (IC) ecosystem, owning a foundry is not economically viable, and therefore most IC design houses are now working under a fabless business model. In order to overcome security concerns associated with the…
Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit…