相关论文: 3D Electronic-Photonic Heterogenous Interconnect P…
As AI systems scale to multi-chiplet and wafer-level architectures, the demand for ultra-high bandwidth and system scalability has outpaced the capabilities of electrical interconnects and computing units. Large-scale heterogeneous…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
The rapid growth of artificial intelligence, coupled with the slowing of Moore's law, is straining computing infrastructure, as CMOS electronics face inherent limits in bandwidth, energy efficiency, and parallelism. Integrated photonic…
Photonic computing promises ultrafast and energy-efficient artificial intelligence. However, existing photonic neural networks (PNNs) remain functionally shallow and difficult to scale. Here we establish a theory-guided framework showing…
Traditional silicon-on-insulator (SOI) platform based on-chip photonic interconnects have limited energy-bandwidth scalability due to the optical non-linearity induced power constraints of the constituent photonic devices. In this paper, we…
Optically active solid-state spin qubits thrive as an appealing technology for quantum interconnect and quantum networking, owing to their atomic size, scalable creation, long-lived coherence, and ability to coherently interface with flying…
This paper presents a 3D-stacked chiplets based large language model (LLM) inference accelerator, consisting of non-volatile in-memory-computing processing elements (PEs) and Inter-PE Computational Network (IPCN), interconnected via silicon…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
The increasing demand for high-speed optical interconnects necessitates integrated photonic and electronic solutions. Electro-optic co-simulation is key to meeting these requirements, which works by importing interoperable photonic models…
Electron-phonon interaction (EPI) is presumably detrimental for thermoelectric performance in semiconductors because it limits carrier mobility. Here we show that enhanced EPI with strong energy dependence offers an intrinsic pathway to…
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm x 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without the need…
Scalable programmable photonic integrated circuits (PICs) can potentially transform the current state of classical and quantum optical information processing. However, traditional means of programming, including thermo-optic, free carrier…
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Data center interconnects (DCIs) will have to support throughputs of 400 Gbps or more per wavelength in the near future. To achieve such high data rates, coherent modulation and detection is used, which conventionally requires high-speed…
Photonic integrated circuits (PICs) play a crucial role in almost every aspect of modern life, such as data storage, telecommunications, medical diagnostics, green energy, autonomous driving, agriculture, and high-performance computing. To…
In this paper we present EPIC, an efficient and effective predictor for IC manufacturing hotspots in deep sub-wavelength lithography. EPIC proposes a unified framework to combine different hotspot detection methods together, such as machine…