相关论文: Through Silicon Via Aware Design Planning for Ther…
RF power coupler is one of the key components in superconducting (SC) linac. It provides RF power to the SC cavity and interconnects different temperature layers (1.8K, 4.2K, 70K and 300K). TTF-III coupler is one of the most promising…
2D topological insulators promise novel approaches towards electronic, spintronic, and quantum device applications. This is owing to unique features of their electronic band structure, in which bulk-boundary correspondences enforces the…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
High precision calorimetry using superconducting transition edge sensors requires the use of superconducting films with a suitable $T_c$, depending on the application. To advance high-precision macrocalorimetry, we require low-$T_c$ films…
One of the ways natural and synthetic systems regulate temperature is via circulating fluids through vasculatures embedded within their bodies. Because of the flexibility and availability of proven fabrication techniques, vascular-based…
This paper presents a semiclassical model for the anisotropic thermal transport in III-V semiconductor superlattices (SLs). An effective interface rms roughness is the only adjustable parameter. Thermal transport inside a layer is described…
Temperature rise of qubits due to heating is a critical issue in large-scale quantum computers based on quantum-dot (QD) arrays. This leads to shorter coherence times, induced readout errors, and increased charge noise. Here, we propose a…
In the current context of high integration of renewable energies, maximizing infrastructures capabilities for electricity transmission is a general need for Transmission System Operators (TSO). The French TSO, RTE, is developing levers to…
Efficient and robust 3D scene representation is crucial in autonomous driving, robotics, and related fields. While RGB images provide valuable content for 3D reconstruction, other modalities like thermal or depth can enable additional…
Intelligent Transportation Systems (ITS) increasingly rely on connectivity for efficient traffic management and enhanced user experience. The existing ITS solutions operate mainly within a 2D domain, thus missing the potential benefits of…
Three-dimensional topological insulators (TIs) are a perfectly tuned quantum-mechanical machinery in which counter-propagating and oppositely spin-polarized conduction channels balance each other on the surface of the material. This…
As the thickness of a three-dimensional (3D) topological insulator (TI) becomes comparable to the penetration depth of the surface states, quantum tunneling between surfaces turns their gapless Dirac electronic structure into a gapped…
Among several solutions to exploit solar energy, thermophotovoltaics (TPV) have been popularized and have known great breakthroughs during the past two decades. Yet, existing systems still have low efficiencies since the wavelength range of…
Two-dimensional (2D) transition metal dichalcogenides (TMDs) are promising platforms for low dimensional superconductivity. However, in conventional intercalated systems, achieving a high superconducting transition temperature (Tc) often…
This manuscript reports a semiconductor-sensitized thermal cell (STC) that converts ambient heat into electrical power while simultaneously reducing its own temperature under isothermal conditions. Using a printable…
We report thermoelectric (TE) properties of topological surface Dirac states (TSDS) in three-dimensional topological insulators (3D-TIs) purely isolated from the bulk by employing single crystal Bi$_{2-x}$Sb$_x$Te$_{3-y}$Se$_y$ films…
Improving the heat transfer coefficient is crucial across various energy utilization processes for maintaining device safety and stability with high energy efficiency. However, in scenarios with limited heat capacity flow rates, increasing…
We present the results of the characterization of pixel modules composed of 75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at…
Dynamic Time Division Duplexing (D-TDD) allows cells to accommodate asymmetric traffic variations with high resource assignment flexibility. However, this feature is limited by two additional types of interference between cells in opposite…
Conventional relays face challenges for transmission lines connected to inverter-based resources (IBRs). In this article, a single-ended intelligent protection of the transmission line in the zone between the grid and the PV farm is…