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We present the 3D Trajectory-based Stress Visualizer (3D-TSV), a visual analysis tool for the exploration of the principal stress directions in 3D solids under load. 3D-TSV provides a modular and generic implementation of key algorithms…

图形学 · 计算机科学 2022-05-18 Junpeng Wang , Christoph Neuhauser , Jun Wu , Xifeng Gao , Rüdiger Westermann

The emergence of connected and automated vehicles (CAVs) provides an unprecedented opportunity to capitalize on these technologies well beyond their original designed intents. While abundant evidence has been accumulated showing substantial…

系统与控制 · 计算机科学 2019-03-21 Mohammad Reza Amini , Xun Gong , Yiheng Feng , Hao Wang , Ilya Kolmanovsky , Jing Sun

Communication and sensing are two important features of connected and autonomous vehicles (CAVs). In traditional vehicle-mounted devices, communication and sensing modules exist but in an isolated way, resulting in a waste of hardware…

信号处理 · 电气工程与系统科学 2023-03-01 Dingyan Cong , Shuaishuai Guo , Shuping Dang , Haixia Zhang

Accurate vehicular sensing is a basic and important operation in autonomous driving. Unfortunately, the existing techniques have their own limitations. For instance, the communication-based approach (e.g., transmission of GPS information)…

信息论 · 计算机科学 2019-05-20 Kaifeng Han , Seung-Woo Ko , Hyukjin Chae , Byoung-Hoon Kim , Kaibin Huang

A comprehensive rational thermal material design paradigm requires the ability to reduce and enhance the thermal conductivities of nanomaterials. In contrast to the existing ability to reduce the thermal conductivity, methods that allow to…

介观与纳米尺度物理 · 物理学 2017-10-09 Abhinav Malhotra , Kartik Kothari , Martin Maldovan

Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation cost and costly cross-design reuse. We propose Therm-FM, a…

计算工程、金融与科学 · 计算机科学 2026-05-26 Zhen Huang , Haiyang Xin , Wenkai Yang , Yangbo Wei , Zhiping Yu , Yu Zhang , Wei W. Xing , Ting-Jung Lin , Lei He

Decreasing thermal conductivity is important for designing efficient thermoelectric devices. Traditional engineering strategies have focused on point defects and interface design. Recently, dislocations as line defects have emerged as a new…

Efficient heat dissipation to the substrate is crucial for optimal device performance in nanoelectronics. We develop a theory of electronic thermal boundary conductance (TBC) mediated by remote phonon scattering for the single-layer…

介观与纳米尺度物理 · 物理学 2020-09-28 Zhun-Yong Ong , Gang Zhang , Linyou Cao , Yong-Wei Zhang

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…

综合物理 · 物理学 2008-01-08 H. Chen , L. Hsu , X. Wei

In this article, we are proposing a thorough analysis of the cross, and the in-plane thermal conductivity of thin-film materials based on the 3$\omega$ method. The analysis accommodates a 2D mathematical heat transfer model of a…

应用物理 · 物理学 2020-07-02 Daxi Zhang , Amir Behbahanian , Nicholas A. Roberts

By using molecular dynamics simulations, we study thermal conductivity of silicon nanowires (SiNWs) with different cross sectional geometries. It is found that thermal conductivity decreases monotonically with the increase of…

介观与纳米尺度物理 · 物理学 2015-06-03 Jie Chen , Gang Zhang , Baowen Li

The thermal conductivity (k) of polycrystalline silicon carbide thin films is relevant for thermal management in emerging silicon carbide applications like MEMS and optoelectronic devices. In such films k can be substantially reduced by…

材料科学 · 物理学 2023-06-09 Lei Tang , Chris Dames

High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal management materials. We report an isotropic high thermal…

Intelligent reflecting surface (IRS) has recently received much attention from the research community due to its potential to achieve high spectral and power efficiency cost-effectively. In addition to traditional cellular networks, the use…

信息论 · 计算机科学 2023-03-17 Wei Jiang , Hans D. Schotten

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…

We propose an enhanced spatial modulation (SM)-based scheme for indoor visible light communication systems. This scheme enhances the achievable throughput of conventional SM schemes by transmitting higher order complex modulation symbol,…

信号处理 · 电气工程与系统科学 2022-01-21 Shimaa Naser , Lina Bariah , Sami Muhaidat , Mahmoud Al-Qutayri , Paschalis C. Sofotasios

The authors use two insulator layers in thermotunnel refrigerator to modify the shape of the tunneling barrier so that electrons with high kinetic energy pass it with increased probability. Theoretical analysis show that the overall…

介观与纳米尺度物理 · 物理学 2008-07-17 Avto Tavkhelidze , Vasiko Svanidze , Leri Tsakadze

Thermoelectric power generators are used to convert heat into electricity. Like any other heat engine, the performance of a thermoelectric generator increases as the temperature difference on the sides increases. It is generally assumed…

经典物理 · 物理学 2015-09-09 Mona Zebarjadi

To facilitate the widespread adoption of renewable energy, dispatchable, zero-emission power sources are essential for grid stability. This work performs a comprehensive techno-economic analysis of a self-sustainable thermophotovoltaic…

系统与控制 · 电气工程与系统科学 2025-10-13 Jihun Lim , Sungwon Lee

As transistor sizes reach the mesoscopic scale, the limitations of traditional methods in ensuring thermodynamic consistency have made power dissipation optimization in transistor amplifiers a critical challenge. Based on stochastic…

信号处理 · 电气工程与系统科学 2025-04-29 Xiaoxuan Peng , Xiaohu Ge