相关论文: Through Silicon Via Aware Design Planning for Ther…
Silicon-on-insulator (SOI) enables for capability improvement of modern information processing systems by replacing some of their electrical counterparts. With the miniaturization of SOI platform, backscattering suppression is one of the…
Synchronous condensers (SCs) play important roles in integrating wind energy into relatively weak power grids. However, the design of SCs usually depends on specific application requirements and may not be adaptive enough to the…
The 3D topological insulator (TI) PN junction under magnetic fields presents a novel transport property which is investigated both theoretically and numerically in this paper. Transport in this device can be tuned by the axial magnetic…
High temperatures have dramatic negative effects on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the…
A theory of combined interference and interaction effects on the diffusive transport properties of 3D topological insulator surface states is developed. We focus on a slab geometry (characteristic for most experiments) and show that…
Limited memory bandwidth is a critical bottleneck in modern systems. 3D-stacked DRAM enables higher bandwidth by leveraging wider Through-Silicon-Via (TSV) channels, but today's systems cannot fully exploit them due to the limited internal…
Accurately measuring the thermal properties of buried interfaces is crucial for understanding heat transport in multilayered materials, particularly in applications such as batteries and integrated circuits. The conventional 3$\omega$…
Vehicle-to-vehicle (V2V) communication is a key component of the future autonomous driving systems. V2V can provide an improved awareness of the surrounding environment, and the knowledge about the future actions of nearby vehicles.…
Three-dimensional topological insulators (TIs) attract much attention due to its topologically protected Dirac surface states. Doping into TIs or their proximity with normal superconductors can promote the realization of topological…
In this paper we present a simple and efficient built-in temperature sensor for thermal monitoring of standard-cell based VLSI circuits. The proposed smart temperature sensor uses a ring-oscillator composed of complex gates instead of…
The low thermal conductivity of silicon nanostructures, with respect to bulk silicon, opens excellent possibilities for thermoelectric applications because it will enable the use of silicon for the high efficient direct conversion of wasted…
Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…
Low dimensional structures have demonstrated improved thermoelectric (TE) performance because of a drastic reduction in their thermal conductivity, {\kappa}l. This has been observed for a variety of materials, even for traditionally poor…
This work investigates the application of Beyond Diagonal Intelligent Reflective Surface (BD-IRS) to enhance THz downlink communication systems, operating in a hybrid: reflective and transmissive mode, to simultaneously provide services to…
Recently, 3D Gaussian Splatting (3D-GS) based on Thermal Infrared (TIR) imaging has gained attention in novel-view synthesis, showing real-time rendering. However, novel-view synthesis with thermal infrared images suffers from transmission…
We investigate the performance of thermoradiative (TR) cells using the III-V group of semiconductors, which include GaAs, GaSb, InAs, and InP, with the aim of determining their efficiency and finding the best TR cell materials among the…
Low power consumption in both static and dynamic modes of operation is a key requirement in modern, highly scaled nanoelectronics. Tunneling field-effect transistors (TFETs) that exploit direct band-to-band tunneling of charges and exhibit…
We describe a novel approach for compressing truncated signed distance fields (TSDF) stored in 3D voxel grids, and their corresponding textures. To compress the TSDF, our method relies on a block-based neural network architecture trained…
The integration of III-V on silicon is still a hot topic as it will open up a way to co-integrate Si CMOS logic with photonic vices. To reach this aim, several hurdles should be solved, and more particularly the generation of antiphase…
Robust person tracking is a critical capability for autonomous mobile robots operating in diverse and unpredictable environments. While RGB-D tracking has shown high precision, its performance severely degrades under challenging…