用于基于单元集成电路热测试的智能温度传感器
硬件体系结构
2011-11-09 v1
摘要
本文提出了一种简单高效的内置温度传感器,用于标准单元基于 VLSI 电路的热监控。该智能温度传感器采用由复杂门而非反相器构成的环形振荡器,以优化其线性度。来自 0.18μm CMOS 工艺的仿真结果表明,当选择一组合适的标准逻辑门时,传感器的非线性误差可以降低。
引用
@article{arxiv.0710.4733,
title = {Smart Temperature Sensor for Thermal Testing of Cell-Based ICs},
author = {S. A. Bota and M. Rosales and J. L. Rossello and J. Segura},
journal= {arXiv preprint arXiv:0710.4733},
year = {2011}
}
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