相关论文: Through Silicon Via Aware Design Planning for Ther…

This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or…

Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…

It is crucial for the studies of the transport properties and quantum effects related to Dirac surface states of three-dimensional topological insulators (3D TIs) to be able to simultaneously tune the chemical potentials of both top and…

Superconducting-proximity topological insulators (STIs) have garnered significant research attention over the past two decades. In this Letter, we demonstrate that a low-dimensional STI in the topological-nontrivial phase (TP) exhibits an…

Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state…

Historically, the design of hybrid solar photovoltaic thermal (PVT) systems has focused on cooling crystalline silicon (c-Si)-based photovoltaic (PV) devices to avoid temperature-related losses. This approach neglects the associated…

We demonstrate highly transparent silicon-vanadium and silicon-aluminum tunnel junctions with relatively low sub-gap leakage current and discuss how a trade-off typically encountered between transparency and leakage affects their…

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…

We study theoretically helical edge states of 2D and 3D topological insulators (TI) tunnel-coupled to metal leads and show that their transport properties are strongly affected by contacts as the latter play a role of a heat bath and induce…

Semantic Communication (SC) combined with Vehicular edge computing (VEC) provides an efficient edge task processing paradigm for Internet of Vehicles (IoV). Focusing on highway scenarios, this paper proposes a Tripartite Cooperative…

Programmability in femtosecond-laser-written integrated circuits is commonly achieved with the implementation of thermal phase shifters. Recent work has shown how such phase shifters display significantly reduced power dissipation and…

Tri-hybrid beamforming architectures have been proposed to enable energy-efficient communications systems in extra-largescale antenna arrays using low-cost programmable metasurface antennas. We study the tri-hybrid beamforming design for…

Since solid-state heat transport in a highly porous nanocomposite strongly depends on the thermal boundary conductance (TBC) between constituent nanomaterials, further suppression of the TBC is important for improving performance of thermal…

This paper proposes a hybrid infrastructure-to-vehicle (I2V) communication framework to support future 6G-enabled intelligent transportation systems (ITS) in smart cities. Leveraging existing LED streetlighting infrastructure, the system…

This thesis proposes novel ternary circuits aiming to reduce energy to preserve battery consumption. The proposed designs include eight ternary logic gates, three ternary combinational circuits, and six Ternary Arithmetic Logic Units. This…

The reduction of the thermal conductivity in nanostructures opens up the possibility of exploiting for thermoelectric purposes also materials such as silicon, which are cheap, available and sustainable but with a high thermal conductivity…

Silicon carbide has excellent physical properties, such as high stability, thermal conductivity, and mechanical strength. It has been widely used in high-power devices, catalysis, material processing, and other fields and is of great…

Developing thermal analogues of field-effect transistor could open the door to a low-power and even zero-power communication technology working with heat rather than electricity. These solid-sate devices could also find many applications in…

The spin-momentum locked nature of the robust surface states of three dimensional topological insulators (3D TI) make them promising candidates for spintronics applications. Surface potentials which respect time reversal symmetry can exist…

The capabilities of a simulation tool for the in-depth analysis of the thermal impacts on the performances of solar cells are described. TASC-1D (Thermal Analysis of Solar Cells - 1D, version cSi) solves the coupled electrical, radiative…