相关论文: Reduced etch lag and high aspect ratios by deep re…

We demonstrate the fabrication of diffraction-limited dielectric metasurface lenses for NIR by use of standard industrial high throughput silicon processing techniques: UV Nano Imprint Lithography (UV-NIL) combined with continuous Reactive…

Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS…

Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely…

Refractive optical elements are widely used in millimeter and sub-millimeter astronomical telescopes. High resistivity silicon is an excellent material for dielectric lenses given its low loss-tangent, high thermal conductivity and high…

In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiN$_x$ membranes using Deep Reactive Ion Etching (DRIE). Large area and high-stress…

This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH). This process…

This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret Vibration Energy Harvesters (VEH). Electrets charged by a…

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single…

Pulsed-laser dry printing of noble-metal microrings with a tunable internal porous structure, which can be revealed via an ion-beam etching post-procedure, was demonstrated. Abundance and average size of the pores inside the microrings were…

In this work, a single crystal CVD diamond film with a novel three-dimensional (3D) interdigitated electrode geometry has been fabricated with the Reactive Ion Etching (RIE) technique in order to increase the charge collection efficiency…

We introduce a method for finely adjusting the etch depth profile by dynamic shielding in the course of ion beam etching (IBE), which is crucial for the ultra-precision fabrication of large optics. We study the physical process of dynamic…

The extended Ptychographical Iterative Engine (ePIE) is a widely used phase retrieval algorithm for Electron Ptychography from 4-dimensional (4-D) Scanning Transmission Electron Microscopy (4-D STEM) measurements acquired with a focused or…

We present the design, fabrication, and characterization of a 100 mm diameter, flat, gradient-index (GRIN) lens fabricated with high-resistivity silicon, combined with a three-layer anti-reflection (AR) structure optimized for 160-355 GHz.…

Glass materials play an increasingly important role in advanced technologies due to their superior physical properties. However, precise machining of glass remains a major challenge because of its brittleness and sensitivity to thermal and…

In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…

Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the…

Fused silica glass is a material of choice for micromechanical, microfluidic, and optical devices due to its ultimate chemical resistance, optical, electrical, and mechanical performance. Wet etching in hydrofluoric solutions especially a…

We report a direct, maskless electron beam-induced etching (EBIE) process for diamond in air, enabling high-precision patterning without lithography or plasma processing. Through a comprehensive analysis of electron-gas, electron-diamond,…

Although high-resistivity, low-loss silicon is an excellent material for THz transmission optics, its high refractive index necessitates antireflection treatment. We fabricated a wide-bandwidth, two-layer antireflection treatment by cutting…

Recent interest in structure solution and refinement using electron diffraction (ED) has been fuelled by its inherent advantages when applied to crystals of sub-micron size, as well as a better sensitivity to light elements. Currently, data…