Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.
@article{arxiv.0711.3276,
title = {Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching},
author = {A. Phommahaxay and G. Lissorgues and L. Rousseau and T. Bourouina and P. Nicole},
journal= {arXiv preprint arXiv:0711.3276},
year = {2007}
}
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