相关论文: Stack up your chips: Betting on 3D integration to …

Phase field simulations play a key role in the understanding of microstructure evolution in additive manufacturing. However, they have been found extremely computationally expensive. One of the reasons is the small time step requirement to…

Coded matrix multiplication is a technique to enable straggler-resistant multiplication of large matrices in distributed computing systems. In this paper, we first present a conceptual framework to represent the division of work amongst…

Stacked intelligent metasurfaces (SIMs) facilitate computation by cascaded programmable layers so that part of the signal processing can be performed in the wave domain during signal propagation, rather than solely after reception. This…

The design of correlated materials challenges researchers to combine the maturing, high throughput framework of DFT-based materials design with the rapidly-developing first-principles theory for correlated electron systems. We review the…

The many cores design research community have shown high interest in optical crossbars on chip for more than a decade. Key properties of optical crossbars, namely a) contention-free data routing b) low-latency communication and c) potential…

Arrival of multicore systems has enforced a new scenario in computing, the parallel and distributed algorithms are fast replacing the older sequential algorithms, with many challenges of these techniques. The distributed algorithms provide…

Limited memory bandwidth is a critical bottleneck in modern systems. 3D-stacked DRAM enables higher bandwidth by leveraging wider Through-Silicon-Via (TSV) channels, but today's systems cannot fully exploit them due to the limited internal…

Solid modeling is a technique underlying CAD software as we see it today, and its theories and algorithms are among the most fundamental milestones in the historical development of CAD. Basically, it has answered the question of what…

We study a simple model for the evolution of the cost (or more generally the performance) of a technology or production process. The technology can be decomposed into $n$ components, each of which interacts with a cluster of $d-1$ other,…

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…

In this paper we present a novel modulation technique for dual polarization communication systems, which reduces the error rate compared with the existent schemes. This modulation places the symbols in a 3D constellation, rather than the…

We present a new blocking linearizable stack implementation which utilizes sharding and fetch&increment to achieve significantly better performance than all existing concurrent stacks. The proposed implementation is based on a novel…

Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…

At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…

Three-dimensional (3D) CMOS technology encourages the use of UV laser annealing (UV-LA) because the shallow absorption of UV light into materials and the process timescale typically from nanoseconds (ns) to microseconds (us) strongly limit…

Successful materials innovations can transform society. However, materials research often involves long timelines and low success probabilities, dissuading investors who have expectations of shorter times from bench to business. A…

Quantum computing holds immense potential for solving classically intractable problems by leveraging the unique properties of quantum mechanics. The scalability of quantum architectures remains a significant challenge. Multi-core quantum…

The advancement of scalable quantum information processing relies on the accurate and parallel manipulation of a vast number of qubits, potentially reaching into the millions. Superconducting qubits, traditionally controlled through…

Scaling laws play an instrumental role in the sustainable improvement in model quality. Unfortunately, recommendation models to date do not exhibit such laws similar to those observed in the domain of large language models, due to the…

The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…