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We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…

Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing…

Computer Vision and 3D printing have rapidly evolved in the last 10 years but interactions among them have been very limited so far, despite the fact that they share several mathematical techniques. We try to fill the gap presenting an…

As an emerging technology, blockchain has achieved great success in numerous application scenarios, from intelligent healthcare to smart cities. However, a long-standing bottleneck hindering its further development is the massive resource…

Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…

Invention of Transistors in 1948 started a new era in technology, called Solid State Electronics. Since then, sustaining development and advancement in electronics and fabrication techniques has caused the devices to shrink in size and…

While past information technology (IT) advances have transformed society, future advances hold even greater promise. For example, we have only just begun to reap the changes from artificial intelligence (AI), especially machine learning…

A three-dimensional (3D) Network-on-Chip (NoC) enables the design of high performance and low power many-core chips. Existing 3D NoCs are inadequate for meeting the ever-increasing performance requirements of many-core processors since they…

Many quantum computing platforms are based on a two-dimensional physical layout. Here we explore a concept called looped pipelines which permits one to obtain many of the advantages of a 3D lattice while operating a strictly 2D device. The…

Nowadays is very common to find headlines in the media where it is stated that 3D printing is a technology called to change our lives in the near future. For many authors, we are living in times of a third industrial revolution. Howerver,…

Although the brain has long been considered a potential inspiration for future computing, Moore's Law - the scaling property that has seen revolutions in technologies ranging from supercomputers to smart phones - has largely been driven by…

Scaling up hardware systems has become an important tactic for improving performance as Moore's law fades. Unfortunately, simulations of large hardware systems are often a design bottleneck due to slow throughput and long build times. In…

The task of 3D ICs layout design involves the assembly of millions of components taking into account many different requirements and constraints such as topological, wiring or manufacturability ones. It is a NP-hard problem that requires…

Semiconductor innovation drives improvements to technologies that are critical to modern society. The country that successfully accelerates semiconductor innovation is positioned to lead future semiconductor-driven industries and benefit…

This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors (CMP) from Amdahl law perspective. We find that 3D CMP may reach its thermal limit before reaching its maximum power. We show that a…

With the rapid development of 3D printing, the demand for personalized and customized production on the manufacturing line is steadily increasing. Efficient merging of printing workpieces can significantly enhance the processing efficiency…

We describe a modified SIMD architecture suitable for single-chip integration of a large number of processing elements, such as 1,000 or more. Important differences from traditional SIMD designs are: a) The size of the memory per processing…

Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of…

Edge-centric distributed computations have appeared as a recent technique to improve the shortcomings of think-like-a-vertex algorithms on large scale-free networks. In order to increase parallelism on this model, edge partitioning -…

Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…