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Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…

The advent of 3D printing has transformed the pharmaceutical industry, enabling precision drug manufacturing with controlled release profiles, dosing, and structural complexity. Additive manufacturing (AM) addresses the growing demand for…

Machine learning technologies have demonstrated immense capabilities in various domains. They play a key role in the success of modern businesses. However, adoption of machine learning technologies has a lot of untouched potential. Cost of…

Given the stringent requirements of energy efficiency for Internet-of-Things edge devices, approximate multipliers, as a basic component of many processors and accelerators, have been constantly proposed and studied for decades, especially…

Floorplanning determines the coordinate and shape of each module in Integrated Circuits. With the scaling of technology nodes, in floorplanning stage especially 3D scenarios with multiple stacked layers, it has become increasingly…

Large-scale floating-point matrix multiplication is a fundamental kernel in many scientific and engineering applications. Most existing work only focus on accelerating matrix multiplication on FPGA by adopting a linear systolic array. This…

In the past decade, a lot of progress has been made in the design and evaluation of logic locking; a premier technique to safeguard the integrity of integrated circuits throughout the electronics supply chain. However, the widespread…

For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods,…

The objective of this article is to report the parallel implementation of the 3D molecular dynamic simulation code for laser-cluster interactions. The benchmarking of the code has been done by comparing the simulation results with some of…

As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…

The hardware computing landscape is changing. What used to be distributed systems can now be found on a chip with highly configurable, diverse, specialized and general purpose units. Such Systems-on-a-Chip (SoC) are used to control today's…

System-level design, once the province of board designers, has now become a central concern for chip designers. Because chip design is a less forgiving design medium -- design cycles are longer and mistakes are harder to correct --…

High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is…

With the end of both Dennard's scaling and Moore's law, computer users and researchers are aggressively exploring alternative forms of computing in order to continue the performance scaling that we have come to enjoy. Among the more salient…

We show that, in the context of Moore's Law, overall productivity can be increased for large enough computations by `slacking' or waiting for some period of time before purchasing a computer and beginning the calculation.

A modern graphics processing unit (GPU) is able to perform massively parallel scientific computations at low cost. We extend our implementation of the checkerboard algorithm for the two dimensional Ising model [T. Preis et al., J. Comp.…

The morphing of 3D structures is suitable for i) future tunable material design for customizing material properties and ii) advanced manufacturing tools for fabricating 3D structures on a 2D plane. However, there is no inverse design method…

Because most technology and computer architecture innovations were (intentionally) invisible to higher layers, application and other software developers could reap the benefits of this progress without engaging in it. Higher performance has…

Matrix-accelerated stencil computation is a hot research topic, yet its application to three-dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of matrix units on multicore CPUs, we analyze matrix-based…

Composite materials are used across engineering applications for their superior mechanical performance, a result of efficient load transfer between the structure and matrix phases. However, the inherently two-dimensional structure of…