相关论文: Thermal analysis of 3D associative processor
Magnetic reconnection has long been known to be the most important mechanism not only for mixing the plasmas by changing the magnetic field topology but also for releasing the magnetic field energy into the plasma kinetic energy. During…
This paper presents a performance model of the ATA/ATAPI SSD Trim command under various types of user workloads, including a uniform random workload, a workload with hot and cold data, and a workload with N temperatures of data. We first…
Due to decelerating gains in single-core CPU performance, computationally expensive simulations are increasingly executed on highly parallel hardware platforms. Agent-based simulations, where simulated entities act with a certain degree of…
Processing-in-Memory (PIM) enhances memory with computational capabilities, potentially solving energy and latency issues associated with data transfer between memory and processors. However, managing concurrent computation and data flow…
Processing-using-DRAM has been proposed for a limited set of basic operations (i.e., logic operations, addition). However, in order to enable the full adoption of processing-using-DRAM, it is necessary to provide support for more complex…
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show…
We investigate the power of the Wang tile self-assembly model at temperature 1, a threshold value that permits attachment between any two tiles that share even a single bond. When restricted to deterministic assembly in the plane, no…
With the widespread use of deep neural networks(DNNs) in intelligent systems, DNN accelerators with high performance and energy efficiency are greatly demanded. As one of the feasible processing-in-memory(PIM) architectures,…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
The higher speed, scalability and parallelism offered by ReRAM crossbar arrays foster development of ReRAM-based next generation AI accelerators. At the same time, sensitivity of ReRAM to temperature variations decreases R_on/Roff ratio and…
Large-number arithmetic, widely used in scientific computing and cryptography, has seen limited adoption of single instruction, multiple data (SIMD) parallelism on modern CPUs due to the inherent dependencies in traditional algorithms. We…
Laser heating during additive manufacturing (AM) induces extreme and transient thermal conditions which critically influence the microstructure evolution and mechanical properties of the resulting component. However, accurately resolving…
Recent developments of the pump-probe thermoreflectance methods (such as the beam-offset and elliptical-beam approaches of the time-domain and frequency-domain thermoreflectance techniques) enabled measurements of the thermal conductivities…
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\mu$m width for…
In distributed massive multiple-input multiple-output (MIMO) systems, multiple geographically separated access points (APs) communicate simultaneously with a user, leveraging the benefits of multi-antenna coherent MIMO processing and…
Heavy fermion materials are compounds in which localized $f$-orbitals hybridize with delocalized $d$ ones, leading to quasiparticles with large renormalized masses. The presence of strongly correlated $f$-electrons at the Fermi level may…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing…
A theory of hot electron cooling power due to polar optical phonons $P_{\rm op}$ is developed in three-dimensional Dirac semimetal($3$DDS) Cd$_3$As$_2$ taking account of hot phonon effect. Hot phonon distribution $N_q$ and $P_{\rm op}$ are…