相关论文: Thermal analysis of 3D associative processor

The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…

With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…

Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While traditional thermal analyses often employ uniform power…

We consider dark matter as Strongly Interacting Massive Particles (SIMPs) in a hidden sector, thermally decoupled from the Standard Model heat bath. Due to its strong interactions, the number-changing processes of the SIMP lead to its…

The 3D Average Precision (3D AP) relies on the intersection over union between predictions and ground truth objects. However, camera-only detectors have limited depth accuracy, which may cause otherwise reasonable predictions that suffer…

We present a new and efficient implementation of Raman cooling of trapped atoms. It uses Raman pulses with an appropriate frequency chirp to realize a velocity selective excitation through a rapid adiabatic passage. This method allows to…

Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…

Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…

Thermal Interface Materials (TIMs) are widely used in electronic packaging. Increasing power density and limited assembly space pose high demands on thermal management. Large cooling surfaces need to be covered efficiently. When joining the…

Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…

Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal…

Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…

Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…

3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of…

Additive manufacturing (AM) techniques hold promise but face significant challenges in process planning and optimization. The large temporal and spatial variations in temperature that can occur in layer-wise AM lead to thermal excursions,…

To stabilize the working temperature of an equipment, a solid-state thermal resistor is usually a requisite, which could adjust its heat conductance continuously according to the temperature. In this work, the thermal conductivity and the…

Joint access point (AP) association and physical carrier sensing (PCS) threshold selection has the potential to improve the performance in high density wireless LANs (WLANs) under high contention, interference and self-interference (SI)…

In complex environments, autonomous robot navigation and environmental perception pose higher requirements for SLAM technology. This paper presents a novel method for semantically enhancing 3D point cloud maps with thermal information. By…

In this article we present a parallel algorithm for simulation of the heat conduction process inside the so-called pulse cryogenic cell. This simulation is important for designing the device for portion injection of working gases into…