相关论文: Thermal analysis of 3D associative processor
In Bayesian statistics, exploring high-dimensional multimodal posterior distributions poses major challenges for existing MCMC approaches. This paper introduces the Annealed Leap-Point Sampler (ALPS), which augments the target distribution…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
Modern computing systems suffer from the dichotomy between computation on one side, which is performed only in the processor (and accelerators), and data storage/movement on the other, which all other parts of the system are dedicated to.…
The ever-increasing quest for data-level parallelism and variable precision in ubiquitous multimedia and Deep Neural Network (DNN) applications has motivated the use of Single Instruction, Multiple Data (SIMD) architectures. To alleviate…
Molecular dynamics facilitates the simulation of a complex system to be analyzed at molecular and atomic levels. Simulations can last a long period of time, even months. Due to this cause the graphics processing units (GPUs) and multi-core…
Using two different configurations of temperature and magnetic field gradients, we observed that, in a quasi one-dimensional magnetic fluid, magnetic force either reduces the temperature difference across the sample when the two gradients…
Loss functions are fundamental to learning accurate 3D point cloud models, yet common choices trade geometric fidelity for computational cost. Chamfer Distance is efficient but permits many-to-one correspondences, while Earth Mover Distance…
Affine Body Dynamics (ABD) within the Incremental Potential Contact (IPC) framework provides accurate simulation of extremely stiff solids exhibiting near-rigid behavior, with strict non-penetration guarantees. However, IPC's globally…
In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The…
Increasing power densities in integrated circuits has led to an increased prevalence of thermal hotspots in integrated circuits. Tracking these thermal hotspots is imperative to prevent circuit failures. In 3D integrated circuits,…
The traditional proportional-integral-derivative (PID) algorithm for regulation suffers from a tradeoff: placing the sensor near the sample being regulated ensures that its steady-state temperature matches the desired setpoint. However, the…
In this project, we design a four-layer (Silicon|TIM|Silicon|TIM), 3D floor plan for NVIDIA GTX480 Fermi GPU architecture and compare heat dissipation and power trends for matrix multiplication and Needleman-Wunsch kernels. First, cuda…
We present an asymptotic-preserving (AP) numerical method for solving the three-temperature radiative transfer model, which holds significant importance in inertial confinement fusion. A carefully designedsplitting method is developed that…
Three-dimensional hybrid PIC simulations are presented to study electron energy transport and deposition in a full-scale fast ignition configuration. Multi-prong core heating close to ignition is found when a few GA, few PW beam is…
Probabilistic computers built from p-bits offer a promising path for combinatorial optimization, but the dense connectivity required by real-world problems scales poorly in hardware. Here, we address this through graph sparsification with…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
We describe a modified SIMD architecture suitable for single-chip integration of a large number of processing elements, such as 1,000 or more. Important differences from traditional SIMD designs are: a) The size of the memory per processing…
With high computation power and memory bandwidth, graphics processing units (GPUs) lend themselves to accelerate data-intensive analytics, especially when such applications fit the single instruction multiple data (SIMD) model. However,…
Architecture-based heat dissipation analyses allow us to reveal fundamental sources of inefficiency in a given processor and thereby provide us with road-maps to design less dissipative computing schemes independent of technology-base used…
A numerical modeling study based on 3D finite element method (FEM) simulation and 1D analytical solutions has been carried out to evaluate the capabilities of two ac methods for measuring in-plane thermal conductivity of thin film deposited…