相关论文: Thermal analysis of 3D associative processor
Asymmetric multicore processors (AMPs) couple high-performance big cores and low-power small cores with the same instruction-set architecture but different features, such as clock frequency or microarchitecture. Previous work has shown that…
Dynamic 3D Gaussian splatting (3DGS) extends static 3DGS to render dynamic scenes, enabling AR/VR applications with moving objects. However, implementing dynamic 3DGS on edge devices faces challenges: (1) Loading all Gaussian parameters…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…
This work proposes an extension of phase change and latent heat models for the simulation of metal powder bed fusion additive manufacturing processes on the macroscale and compares different models with respect to accuracy and numerical…
A three-dimensional model of a partially melted powder bed with particles stochastically distributed in size and space coordinates has been developed. Numerical simulation of temperature distributions in stainless steel AISI 316L and…
In the abstract Tile Assembly Model (aTAM), the phenomenon of cooperation occurs when the attachment of a new tile to a growing assembly requires it to bind to more than one tile already in the assembly. Often referred to as…
Ultra-fast electronic phenomena originating from finite temperature, such as nonlinear optical excitation, can be simulated with high fidelity via real-time time dependent density functional theory (rt-TDDFT) calculations with hybrid…
An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily…
We review several parallel tempering schemes and examine their main ingredients for accuracy and efficiency. The present study covers two selection methods of temperatures and several choices for the exchange of replicas, including a recent…
The additivity principle (AP), conjectured by Bodineau and Derrida [Phys. Rev. Lett. vol.92, 180601 (2004)], is discussed for the case of heat conduction in three-dimensional disordered harmonic lattices to consider the effects of…
Generative Recommendation (GR) has recently transitioned from atomic item-indexing to Semantic ID (SID)-based frameworks to capture intrinsic item relationships and enhance generalization. However, the adoption of high-granularity SIDs…
Computing-in-Memory (CiM) is a promising paradigm to address the memory bottleneck constraining traditional systems. Most power-efficient CiM variants can directly perform Boolean operations in non-volatile memory arrays. Higher…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
Simultaneous Localization and Mapping (SLAM) with dense representation plays a key role in robotics, Virtual Reality (VR), and Augmented Reality (AR) applications. Recent advancements in dense representation SLAM have highlighted the…
Recent reported very high thermal conductivities in the cubic boron arsenide (BAs) and boron phosphide (BP) crystals could potentially provide a revolutionary solution in the thermal management of high power density devices. To fully…
We employ adaptive mesh refinement, implicit time stepping, a nonlinear multigrid solver and parallel computation, to solve a multi-scale, time dependent, three dimensional, nonlinear set of coupled partial differential equations for three…
This article describes algorithms for the hybrid parallelization and SIMD vectorization of molecular dynamics simulations with short-range forces. The parallelization method combines domain decomposition with a thread-based parallelization…
Additive Manufacturing (AM) is a manufacturing paradigm that builds three-dimensional objects from a computer-aided design model by successively adding material layer by layer. AM has become very popular in the past decade due to its…
This paper presents a method to simulate the thermal behavior of 3D systems using a graph neural network. The method discussed achieves a significant speed-up with respect to a traditional finite-element simulation. The graph neural network…