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Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturization in…

Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS…

We demonstrate the fabrication of diffraction-limited dielectric metasurface lenses for NIR by use of standard industrial high throughput silicon processing techniques: UV Nano Imprint Lithography (UV-NIL) combined with continuous Reactive…

Refractive optical elements are widely used in millimeter and sub-millimeter astronomical telescopes. High resistivity silicon is an excellent material for dielectric lenses given its low loss-tangent, high thermal conductivity and high…

We introduce a method for finely adjusting the etch depth profile by dynamic shielding in the course of ion beam etching (IBE), which is crucial for the ultra-precision fabrication of large optics. We study the physical process of dynamic…

This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH). This process…

In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiN$_x$ membranes using Deep Reactive Ion Etching (DRIE). Large area and high-stress…

In this paper, we present an interesting method to microfabricate a tilted micro air jet generator. We used the well-know deep reactive ion etching (DRIE) technique in order to realize in a silicon substrate a double side etching. For…

We report a direct, maskless electron beam-induced etching (EBIE) process for diamond in air, enabling high-precision patterning without lithography or plasma processing. Through a comprehensive analysis of electron-gas, electron-diamond,…

We present the design, fabrication, and characterization of a 100 mm diameter, flat, gradient-index (GRIN) lens fabricated with high-resistivity silicon, combined with a three-layer anti-reflection (AR) structure optimized for 160-355 GHz.…

Although high-resistivity, low-loss silicon is an excellent material for THz transmission optics, its high refractive index necessitates antireflection treatment. We fabricated a wide-bandwidth, two-layer antireflection treatment by cutting…

This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret Vibration Energy Harvesters (VEH). Electrets charged by a…

Fused silica glass is a material of choice for micromechanical, microfluidic, and optical devices due to its ultimate chemical resistance, optical, electrical, and mechanical performance. Wet etching in hydrofluoric solutions especially a…

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single…

Future observatories utilizing reflection grating spectrometers for extreme ultraviolet (EUV) and soft X-ray (SXR) spectroscopy require high-fidelity gratings with both blazed groove facets and custom groove layouts that are often fanned or…

Silicon optics with wide bandwidth anti-reflection (AR) coatings, made of multi-layer textured silicon surfaces, are developed for millimeter and submillimeter wavelengths. Single and double layer AR coatings were designed for an optimal…

Adhesion control at the interface of two surfaces is crucial in many applications. Examples are the design of micro and nanodevices such as microfuidics devices, biochips, and electronic sensors. Adhesion at the interface of two materials…

Pulsed-laser dry printing of noble-metal microrings with a tunable internal porous structure, which can be revealed via an ion-beam etching post-procedure, was demonstrated. Abundance and average size of the pores inside the microrings were…

Glass materials play an increasingly important role in advanced technologies due to their superior physical properties. However, precise machining of glass remains a major challenge because of its brittleness and sensitivity to thermal and…

High-index dielectric metasurfaces featuring Mie-type electric and magnetic resonances have been of a great interest in a variety of applications such as imaging, sensing, photovoltaics and others, which led to the necessity of an efficient…