相关论文: 3D Electronic-Photonic Heterogenous Interconnect P…
Three-dimensional (3D) photonic integrated circuits (PIC) are emerging as an indispensable scheme for high density and multifunctional photonic systems. However, the wafer-scale scaling of PICs towards a 3D configuration is constrained by…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities across diverse fields ranging from fundamental science [1] to medicine [2] and environmental science [3] by leveraging advanced…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
We challenge the current thinking and approach to the design of photonic integrated circuits (PICs) for applications in communications, quantum information and sensing. The standard PICs are based on directional couplers, that provide a…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…
Optics offers unique opportunities for reducing energy in information processing and communications while resolving the problem of interconnect bandwidth density inside machines. Such energy dissipation overall is now at environmentally…
The relentless growth of large-scale artificial intelligence (AI) has created unprecedented demand for computational power, straining the energy, bandwidth, and scaling limits of conventional electronic platforms. Electronic-photonic…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Fully Homomorphic Encryption (FHE) facilitates secure computations on encrypted data but imposes significant demands on memory bandwidth and computational power. While current FHE accelerators focus on optimizing computation, they often…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
Photonic Integrated Circuits (PICs) provide superior speed, bandwidth, and energy efficiency, making them ideal for communication, sensing, and quantum computing applications. Despite their potential, PIC design workflows and integration…
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics…
While photonic integrated circuits (PICs) are being widely used in applications such as telecommunications and datacenter interconnects, PICs capable of replacing bulk optics and fibers in high-precision, highly-coherent applications will…
Extending two-dimensional photonic integrated circuits (PICs) to three-dimensional (3D) configurations promises great potential for scaling up integration, enhancing functionality, and improving performance of PICs. Silicon-based 3D PICs…
Photonic integrated circuits (PIC) currently rely on application-specific designs that are geared towards a particular functionality. Development of such application-specific PIC requires considerable effort and often involves several…
The drastic increase of bandwidth demands in AI datacenters requires new solutions with low power consumption and high bandwidth densities. Further increasing the total bandwidth with copper interconnects is challenging, thus it is crucial…
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling…