相关论文: US Microelectronics Packaging Ecosystem: Challenge…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…
In the pursuit of a carbon-neutral future, hydrogen emerges as a pivotal element, serving as a carbon-free energy carrier and feedstock. As efforts to decarbonize sectors such as heating and transportation intensify, understanding and…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
The hardware computing landscape is changing. What used to be distributed systems can now be found on a chip with highly configurable, diverse, specialized and general purpose units. Such Systems-on-a-Chip (SoC) are used to control today's…
Continuous integration (CI) has become a ubiquitous practice in modern software development, with major code hosting services offering free automation on popular platforms. CI offers major benefits, as it enables detecting bugs in code…
This essay investigates the role of cost in the development and production of secure integrated circuits. Initially, I make a small introduction on hardware attacks on smart cards and some of the reasons behind them. Subsequently, I…
Designers use third-party intellectual property (IP) cores and outsource various steps in the integrated circuit (IC) design and manufacturing flow. As a result, security vulnerabilities have been rising. This is forcing IC designers and…
Modern electronic systems become evermore complex, yet remain modular, with integrated circuits (ICs) acting as versatile hardware components at their heart. Electronic design automation (EDA) for ICs has focused traditionally on power,…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…
Hardware specialization is commonly viewed as a way to scale performance in the dark silicon era with modern-day SoCs featuring multiple tens of dedicated accelerators. By only powering on hardware circuitry when needed, accelerators…
With the fast change of information and communication technologies and global economics manufacturing industry faces the challenges in both market and supply sides. The challenges in the market include short product life cycle, demand…
Over the years, many techniques have been introduced to protect integrated circuits (ICs) from hardware security threats that emerged in the globalized IC manufacturing supply chain, such as overproduction and piracy. However, most of these…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
The semiconductor industry is fully globalized and integrated circuits (ICs) are commonly defined, designed and fabricated in different premises across the world. This reduces production costs, but also exposes ICs to supply chain attacks,…
The era of widespread globalization has led to the emergence of hardware-centric security threats throughout the IC supply chain. Prior defenses like logic locking, layout camouflaging, and split manufacturing have been researched…
Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools…
Modern hardware environments are becoming increasingly heterogeneous, leading to the emergence of applications specifically designed to exploit this heterogeneity. Efficiently adopting locks in these applications poses distinct challenges.…
Mitigating losses from supply and demand volatility in the semiconductor supply chain and market has traditionally been cast as a logistics and forecasting problem. We investigate how the architecture of a family of chips influences how it…
Image processing applications are common in every field of our daily life. However, most of them are very complex and contain several tasks with different complexities which result in varying requirements for computing architectures.…