相关论文: US Microelectronics Packaging Ecosystem: Challenge…
With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the…
In recent times, the trend in very large scale integration (VLSI) industry is multi-dimensional, for example, reduction of energy consumption, occupancy of less space, precise result, less power dissipation, faster response. To meet these…
The computing industry is forced to find alternative design approaches and computing platforms to sustain increased power efficiency, while providing sufficient performance. Among the examined solutions, Approximate Computing, Hardware…
Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…
The electronic chip industry embodies the height of technological sophistication and economics of scale. Fabricating inexpensive photonic components by leveraging this mighty manufacturing infrastructure has fueled intense interest in…
The edge computing paradigm has emerged to handle cloud computing issues such as scalability, security and low response time among others. This new computing trend heavily relies on ubiquitous embedded systems on the edge. Performance and…
The increasing cost of integrated circuit (IC) fabrication has driven most companies to "go fabless" over time. The corresponding outsourcing trend gave rise to various attack vectors, e.g., illegal overproduction of ICs, piracy of the…
Increasing system-on-chip (SoC) heterogeneity, deep hardware/software integration, and the proliferation of third-party intellectual property (IP) have brought security validation to the forefront of semiconductor design. While simulation…
Today's world of scientific software for High Energy Physics (HEP) is powered by x86 code, while the future will be much more reliant on accelerators like GPUs and FPGAs. The portable parallelization strategies (PPS) project of the High…
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Hydrogen storage remains a central bottleneck for scalable hydrogen energy systems due to the multiscale and coupled nature of the thermodynamics, kinetics, and microstructural evolution of hydrogen storage materials (HSMs). Although…
Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…
Photolithography is believed to be a complementary technique to large-area printing, allowing for nanometer-scale integration and offering cost-efficiency. For organic electronics though, adapting photolithography is very challenging due to…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
As semiconductor scaling reaches the A16 / 2 nm node, the integration of co-packaged optics (CPO) via TSMC's Co-Packaged Optics Ultra Engine (COUPE) architecture introduces critical thermal-optical coupling challenges. Micro-ring resonators…
The emergence of new, off-path smart network cards (SmartNICs), known generally as Data Processing Units (DPU), has opened a wide range of research opportunities. Of particular interest is the use of these and related devices in tandem with…
Hardware specialization is becoming a key enabler of energyefficient performance. Future systems will be increasingly heterogeneous, integrating multiple specialized and programmable accelerators, each with different memory demands.…
This paper presents a planning strategy for the deployment of smart electromagnetic entities (SEEs) to enhance the wireless coverage and the Quality-of-Service (QoS) in large urban areas. The integration of different technological solutions…
Over the last decade we have witnessed an increasing use of data processing in embedded systems. Where in the past the data processing was limited (if present at all) to the handling of a small number of "on-off control signals", more…