相关论文: Formal derivation of an inversion formula for the …

Hidden defects affecting the interface in a composite slab are evaluated from thermal data collected on the upper side of the specimen. First we restrict the problem to the upper component of the object. Then we investigate heat transfer…

Let $\Omega_\epsilon$ be a metallic plate whose top inaccessible surface has been damaged by some chemical or mechanical agent. We heat the opposite side and collect a sequence of temperature maps $u^\epsilon$. Here, we construct a formal…

Numerical inverse Laplace transforms are used to analyze the transient response of non-ideal transmission lines to a voltage step. We find that the detailed shape of the transient response is sensitive conductor losses, but insensitive to…

We consider the asymptotic behaviour of the effective thermal conductivity of a two-phase composite obtained by introducing into an infinite homogeneous matrix a periodic set of inclusions of a different material and of size proportional to…

In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…

Active thermography is a non-destructive testing technique to detect the internal structure of a heat conductor, which is widely applied in industrial engineering. In this paper, we consider the problem of identifying an unknown cavity with…

Motivated by practical applications in heat conduction and contaminant transport, we consider heat and mass diffusion across a perturbed interface separating two finite regions of distinct diffusivity. Under the assumption of continuity of…

An inverse problem for a stationary heat transfer process is studied for a totally isolated bar on its lateral surface, of negligible diameter, made up of two consecutive sections of different, isotropic and homogeneous materials. At the…

A fast inverse heat conduction model (IHCM) is developed for estimating unknown properties of multi-layer composites considering internal heat generation. This work builds on the validated analytical forward models presented in Part I.…

This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…

The existed theories and methods for calculating interfacial thermal conductance of solid-solid interface lead to diverse values that deviate from experimental measurements. In this letter, We propose a model to estimate the ITC at high…

We develop an effective medium model of thermal conductivity that accounts for both percolation and interface scattering. This model accurately explains the measured increase and decrease of thermal conductivity with loading in composites…

Since the thermal conduction equation has form invariance under coordinate transformation, one can design thermal metamaterials with novel functions by tailoring materials' thermal conductivities. In this work, we establish a different…

This paper deals with the solution of an inverse problem for the heat equation aimed at nondestructive evaluation of fractures. A fundamental step in any typical iterative inversion method, is the numerical solution of the underlying direct…

We investigate the effective thermal conductivity of a two-phase composite with thermal resistance at the interface. The composite is obtained by introducing into an infinite homogeneous matrix a periodic set of inclusions of a different…

The interface of two solids in contact introduces a thermal boundary resistance (TBR), which is challenging to measure from experiments. Besides, if the interface is reactive, it can form an intermediate recrystallized or amorphous region,…

An intrinsic feature of nearly all internal interfaces in crystalline systems (homo- and hetero-phase) is the presence of disconnections (topological line defects constrained to the interface that have both step and dislocation character).…

Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…

A coupled cohesive zone model based on an analogy between fracture and contact mechanics is proposed to investigate debonding phenomena at imperfect interfaces due to thermomechanical loading and thermal fields in bodies with cohesive…

The acoustic mismatch model and the diffuse mismatch model have been widely used to predict the thermal interface conductance. However, the acoustic mismatch model (diffuse mismatch model) is based on the hypothesis of a perfectly smooth…