相关论文: FDSOI Process Based MIV-transistor Utilization for…
Van der Waals (vdW) semiconductors are attractive for highly scaled devices and heterogeneous integration since they can be isolated into self-passivated, two-dimensional (2D) layers that enable superior electrostatic control. These…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using…
Light-emitting diodes (LEDs) can bridge the gap between narrow linewidth, expensive lasers and broadband, inefficient thermal globars for low-cost chemical sensing in the mid-infrared (mid-IR). However, the efficiency of III-V based mid-IR…
Making ultra-short gate-length transistors significantly contributes to scaling the contacted gate pitch. This, in turn, plays a vital role in achieving smaller standard logic cells for enhanced logic density scaling. As we push the…
We have fabricated 2024 pixel microwave kinetic inductance detector (MKID) arrays in the ultraviolet/optical/near-IR (UVOIR) regime that are currently in use in astronomical instruments. In order to make MKIDs desirable for novel…
We present a survey of the structural and magnetic properties of submonolayer transition metal dioxides on the (001) surfaces of the heavy face-centered cubic (fcc) noble metals Ir and Pt performed by spin-averaged scanning tunneling…
Recent open-vocabulary 3D scene understanding approaches mainly focus on training 3D networks through contrastive learning with point-text pairs or by distilling 2D features into 3D models via point-pixel alignment. While these methods show…
Layered two-dimensional (2D) materials provide unique structural features, such as physical gaps between their layers that are only connected through van der Waals (vdW) forces. These vdW gaps can guide the migration of intercalated ions…
Two-dimensional (2D) semiconductors are promising material candidates for next-generation nanoelectronics. However, there are fundamental challenges related to their metal-semiconductor (MS) contacts which limit the performance potential…
We report fabrication and characteristics of an organic monolayer based Metal Oxide Semiconductor (MOS) device. In place of SiO2 oxide layer in the MOS configuration, we used 1H, 1H, 2H, 2H- perfluorooctyl trichlorosilane (FOTS)…
We study the generalized degrees-of-freedom (GDoF) of cellular networks under finite precision channel state information at the transmitters (CSIT). We consider downlink settings modeled by the interfering broadcast channel (IBC) under no…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
The development of medium-voltage direct current (MVDC) cable systems for wide-body all-electric aircraft (AEA) requires insulation technologies capable of operating reliably under reduced-pressure environments. Conventional underground…
The need for a high-performance transceiver with high Signal to Noise Ratio (SNR) has driven the communication system to utilize the latest technique identified as oversampling systems. It was the most economical modulator and decimation in…
The ever-increasing quest for data-level parallelism and variable precision in ubiquitous multimedia and Deep Neural Network (DNN) applications has motivated the use of Single Instruction, Multiple Data (SIMD) architectures. To alleviate…
Focused electron beam induced deposition (FEBID) is a powerful technique for 3D-printing of complex nanodevices. However, for resolutions below 10 nm, it struggles to control size, morphology and composition of the structures, due to a lack…
Expanding far beyond traditional applications in optical interconnects at telecommunications wavelengths, the silicon nanophotonic integrated circuit platform has recently proven its merits for working with mid-infrared (mid-IR) optical…
Very large-scale integration of devices in a circular pattern has several advantages over the commonly used rectangular grid layout. For the development of such integrated circuits on a 2D semiconductor platform, spontaneous growth of the…
Massive multiple-input--multiple-output (MIMO) systems can suffer from coherent intercell interference due to the phenomenon of pilot contamination. This paper investigates a two-layer decoding method that mitigates both coherent and…