相关论文: FDSOI Process Based MIV-transistor Utilization for…
Neural networks have been applied to the physical layer of wireless communication systems to solve complex problems. In millimeter wave (mmWave) massive multiple-input multiple-output (MIMO) systems, hybrid precoding has been considered as…
Flexible intelligent metasurfaces (FIMs) show great potential for improving the wireless network capacity in an energy-efficient manner. An FIM is a soft array consisting of several low-cost radiating elements. Each element can…
Leveraging the multilayer realization of programmable metasurfaces, stacked intelligent metasurfaces (SIM) enable fine-grained wave-domain control. However, their wideband deployment is impeded by two structural factors: (i) a single,…
Monolithic three-dimensional (3D) Paul traps combine the high-precision microfabrication of two-dimensional (2D) chip traps with the deep trapping potentials and low heating rates characteristic of macroscopic 3D Paul traps, which are…
Lateral two-dimensional (2D) tunnel diodes that reproduce metal-insulator-metal (MIM)-diode-like rectification without using dissimilar contacts are attractive for scalable nanoelectronics. MoS$_2$ can exist in both the semiconducting 1H…
As semiconductor devices approach the sub-2 nm technology node, identifying the quantum-mechanical limits of contact-resistance scaling becomes imperative; however, the transition from thermionic emission to direct tunneling in this deep…
We combine matrix-product state (MPS) and Mean-Field (MF) methods to model the real-time evolution of a three-dimensional (3D) extended Hubbard system formed from one-dimensional (1D) chains arrayed in parallel with weak coupling in-between…
Epitaxially integrated III-V semiconductor lasers for silicon photonics have the potential to dramatically transform information networks, but currently, dislocations limit performance and reliability even in defect tolerant InAs quantum…
In the past few years, we have witnessed an increased interest in the use of 2D materials for the realization of hybrid photonic nonlinear waveguides. Although graphene has attracted most of the attention, other families of 2D materials…
This paper proposes a correlation-based three-stage channel estimation strategy with low pilot overhead for reconfigurable intelligent surface (RIS)-aided millimeter wave (mmWave) multi-user (MU) MIMO systems, in which both users and base…
In this work, a single crystal CVD diamond film with a novel three-dimensional (3D) interdigitated electrode geometry has been fabricated with the Reactive Ion Etching (RIE) technique in order to increase the charge collection efficiency…
The direct growth of III-V materials on silicon is a key enabler for developing monolithically integrated lasers, offering substantial potential for ultra-dense photonic integration in vital communications and computing technologies.…
The atomic structure at the interface between two-dimensional (2D) and three-dimensional (3D) materials influences properties such as contact resistance, photo-response, and high-frequency electrical performance. Moir\'e engineering is yet…
The semiconductor-metal junction is one of the most critical factors for high performance electronic devices. In two-dimensional (2D) semiconductor devices, minimizing the voltage drop at this junction is particularly challenging and…
Microfabrication using nano- to micron-sized building blocks holds great potential for applications in next-generation electronics, optoelectronics, and advanced materials. However, traditional methods like chemical vapor deposition and…
Three-dimensional (3D) superconducting microwave cavities with large mode volumes typically have high quality factors ($>10^6$). This is due to a reduced sensitivity to surface dielectric losses, which is the limiting source of dissipation…
In this paper, we study the low-complexity iterative soft-input soft-output (SISO) detection algorithm in a large-scale distributed multiple-input multiple-output (MIMO) system. The uplink interference suppression matrix is designed to…
Holographic multiple-input multiple-output (MIMO) has emerged as a key enabler for 6G networks, yet conventional planar implementations suffer from spatial correlation and mutual coupling at sub-wavelength spacing, which fundamentally limit…
Advancing complementary metal-oxide-semiconductor (CMOS) technology into the sub-1-nm angstr\"om-scale technology nodes is expected to involve alternative semiconductor channel materials, as silicon transistors encounter severe performance…
Computation intensive kernels, such as convolutions, matrix multiplication and Fourier transform, are fundamental to edge-computing AI, signal processing and cryptographic applications. Interleaved-Multi-Threading (IMT) processor cores are…