相关论文: An Interposer-Based Root of Trust: Seize the Oppor…
Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries.…
Industry is moving towards large-scale systems where processor cores, memories, accelerators, etc.\ are bundled via 2.5D integration. These various components are fabricated separately as chiplets and then integrated using an interconnect…
With transistor scaling reaching its limits, interposer-based integration of dies (chiplets) is gaining traction. Such an interposer-based integration enables finer and tighter interconnect pitch than traditional system-on-packages and…
Modern system-in-package (SiP) platforms increasingly adopt reconfigurable interposers to enable plug-and-play chiplet integration across heterogeneous multi-vendor ecosystems. However, this flexibility introduces severe trust challenges,…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller and modular chiplets are integrated onto a single interposer. While chiplet…
In response to the growing demand for enhanced performance and power efficiency, the semiconductor industry has witnessed a paradigm shift toward heterogeneous integration, giving rise to 2.5D/3D chips. These chips incorporate diverse…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…
Security is an important facet of integrated circuit design for many applications. IP privacy and Trojan insertion are growing threats as circuit fabrication in advanced nodes almost inevitably relies on untrusted foundries. A proposed…
Smartphone owners often need to run security-critical programs on the same device as other untrusted and potentially malicious programs. This requires users to trust hardware and system software to correctly sandbox malicious programs,…
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substrates are used to implement the inter-chiplet…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
The globalization of semiconductor supply chains has exposed Network-on-Chip (NoC) interconnects in System-on-Chip (SoC) architectures to critical security risks, including reverse engineering and IP theft. To address these threats, this…
Modern IoT and embedded platforms must start execution from a known trusted state to thwart malware, ensure secure firmware updates, and protect critical infrastructure. Current approaches to establish a root of trust depend on secret keys…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
The rapid integration of artificial intelligence (AI) into Internet of Things (IoT) and edge computing systems has intensified the need for robust, hardware-rooted trust mechanisms capable of ensuring device authenticity and AI model…
The rapid adoption of chiplet-based heterogeneous integration is reshaping semiconductor design by enabling modular, scalable, and faster time-to-market solutions for AI and high-performance computing. However, multi-vendor assembly in…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…