相关论文: Temperature measurement of sub-micrometric ICs by …
Thermal mode spectroscopy (TMS) has been recently proposed for accurately measuring thermal diffusivity of solids from a temperature decay rate of a specific thermal mode selected by three- dimensional (anti)nodal information [Phys. Rev.…
Thermal properties have an outsized impact on efficiency and sensitivity of devices with nanoscale structures, such as in integrated electronic circuits. A number of thermal conductivity measurements for semiconductor nanostructures exist,…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
Superconducting microwave resonators have recently gained a primary importance in the development of cryogenic applications, such as circuit quantum electrodynamics, electron spin resonance spectroscopy and particles detection for…
The rising complexity of cutting-edge cryogenic systems is currently imposing challenging technical constraints to the monitoring of ultra-cold temperatures through standard commercially available sensors. Among different alternative…
A way to increase the Scanning Thermal Microscope (SThM) sensitivity in the harmonic 3w mode is to heat the probe with an AC current sufficiently high to generate a coupling between the AC and the DC signals. We detail in this paper how to…
We develop Johnson noise thermometry applicable to mesoscopic devices with variable source impedance with high bandwidth for fast data acquisition. By implementing differential noise measurement and two-stage impedance matching, we…
Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this…
In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed…
The work describes the capabilities of Laser Scanning Microscopy (LSM) as a spatially resolved method of testing high_Tc materials and devices. The earlier results obtained by the authors are briefly reviewed. Some novel applications of the…
A simple and low cost apparatus has been designed and built to measure the electrical resistivity, ($\rho$), of metal and semiconductors in 300-620 K temperature range. The present design is suitable to do measurement on rectangular bar…
Measuring thermodynamic quantities can be easy or not, depending on the system that is being studied. For a macroscopic object, measuring temperatures can be as simple as measuring how much a column of mercury rises when in contact with the…
The microelectronics industry is pushing the fundamental limit on the physical size of individual elements to produce faster and more powerful integrated chips. These chips have nanoscale features that dissipate power resulting in nanoscale…
Various chips for the silicon sensors measurements are described. These chips are based on 0.35 um and 0.18um CMOS technology. Several analog chips together with self-trigger /derandomizer one allow to measure silicon sensors designed for…
Precise temperature measurement at micro/nanoscale is crucial across various domains including physical sciences, chemical processes, industrial production, medical diagnosis, weather forecasting, electronics, and biology. Micro/nanoscale…
Topological insulators (TIs) are a new class of quantum materials that exhibit spin momentum locking (SML) of massless Dirac fermions in the surface states. Usually optical methods, such as angle and spin-resolved photoemission…
We report on the development of an induction based low temperature high frequency ac susceptometer capable of measuring at frequencies up to 3.5 MHz and at temperatures between 2 K and 300 K. Careful balancing of the detection coils and…
The reduction of the thermal conductivity in nanostructures opens up the possibility of exploiting for thermoelectric purposes also materials such as silicon, which are cheap, available and sustainable but with a high thermal conductivity…
The photoacoustic method with piezoelectric detection for the simultaneous evaluation of the thermophysical properties is proposed. The approach is based on the settling of an additional heat sink for redistribution of heat fluxes deposited…
Pulsed laser processing is playing a crucial role in additive manufacturing and nanomaterial processing. However, probing transient temperature during laser interaction with the processed materials is challenging with both high spatial and…