相关论文: Contactless Thermal Characterization Method of PCB…
In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the…
In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…
This paper presents a novel method to estimate the power consumption of distinct active components on an electronic carrier board by using thermal imaging. The components and the board can be made of heterogeneous material such as plastic,…
This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…
We introduce a technique based on infrared thermal emission, termed depth thermography, that can remotely measure the temperature distribution beneath the surface of certain objects. Depth thermography utilizes the thermal-emission spectrum…
Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
We present a Raman-based Distributed Temperature Sensor (RDTS) with centimetre-scale resolution for thermographic analysis of electronic circuits. Temperature is measured along a single-mode fiber routed across a custom printed circuit…
We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room…
This work introduces a thermoreflectance-based system designed to measure the surface temperature field of activated microelectronic devices at submicron spatial resolution with either a laser or a CCD camera. The article describes the…
Quantifying the temperature of microdevices is critical for probing nanoscale energy transport.Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become…
Semiconductor integrated circuits operated at cryogenic temperature will play an essential role in quantum computing architectures. These can offer equivalent or superior performance to their room-temperature counterparts while enabling a…
Two-color (2C) pyrometry has long been used for flame temperature and soot concentration studies and is now becoming more widely used to measure surface temperatures of burning materials. With the obvious advantage of being a contact-free…
Estimation of thermal contact resistances between cylinders can be achieved using heating on the cross sections by a laser spot and measurement of the temperature response by IR thermography. This type of measurement makes it possible to…
We report a model-based method for quantifying heat flow and storage in thermal systems using data from multiple thermal sensors. This approach avoids stringent requirements on the system geometry and sensor positions and enables…
Recent research is trying to leverage occupants' demand in the building's control loop to consider individuals' well-being and the buildings' energy savings. To that end, a real-time feedback system is needed to provide data about…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue…
The next generation of ultra-low-noise cryogenic detectors for space science applications require continued exploration of materials characteristics at low temperatures. The low noise and good energy sensitivity of current Transition Edge…