用于 CEPC 顶点探测器的 180 nm CMOS 像素传感器束流测试
仪器与探测器
2023-11-13 v1 高能物理 - 实验
摘要
拟议的环形正负电子对撞机（CEPC）在像素尺寸与材料预算方面对顶点探测器提出了新挑战。为应对高空间分辨率需求，开发了基于列 drain 读出架构的称为 TaichuPix 的单片有源像素传感器（MAPS）原型。为评估 TaichuPix-3 芯片性能，于 2022 年 12 月在 DESY II TB21 开展了束流测试。同时，多平面配置的获取数据（DAQ）在束流测试期间得到检验。本工作给出了采用两种不同工艺的 TaichuPix-3 芯片的表征，包括簇大小、空间分辨率与探测效率。分析结果表明，两种工艺的 TaichuPix-3 芯片空间分辨率优于 5 ，探测效率超过 99.5 %。
引用
@article{arxiv.2311.05932,
title = {Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector},
author = {Tianya Wu and Shuqi Li and Wei Wang and Jia Zhou and Ziyue Yan and Yiming Hu and Xiaoxu Zhang and Zhijun Liang and Wei Wei and Ying Zhang and Xiaomin Wei and Xinhui Huang and Lei Zhang and Ming Qi and Hao Zeng and Xuewei Jia and Jun Hu and Jinyu Fu and Hongyu Zhang and Gang Li and Linghui Wu and Mingyi Dong and Xiaoting Li and Raimon Casanova and Liang Zhang and Jianing Dong and Jia Wang and Ran Zheng and Weiguo Lu and Sebastian Grinstein and João Guimarães da Costa},
journal= {arXiv preprint arXiv:2311.05932},
year = {2023}
}