Related papers: ePlace-3D: Electrostatics based Placement for 3D-I…
In this paper, we present a new analytical 3D placement framework with a bistratal wirelength model for F2F-bonded 3D ICs with heterogeneous technology nodes based on the electrostatic-based density model. The proposed framework, enabled…
Global placement is essential for high-quality and efficient circuit placement for complex modern VLSI designs. Recent advancements, such as electrostatics-based analytic placement, have improved scalability and solution quality. This work…
This study presents a framework for optimizing the two-dimensional (2D) placement of electric motorcycle powertrain elements, accounting for the position, the orientation and geometric irregularities. Specifically, we construct a 2D…
This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model,…
This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow…
Placement is an essential task in modern chip design, aiming at placing millions of circuit modules on a 2D chip canvas. Unlike the human-centric solution, which requires months of intense effort by hardware engineers to produce a layout to…
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…
Global placement, a critical step in designing the physical layout of computer chips, is essential to optimize chip performance. Prior global placement methods optimize each circuit design individually from scratch. Their neglect of…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
This paper presents the novel idea of multi-placement structures, for a fast and optimized placement instantiation in analog circuit synthesis. These structures need to be generated only once for a specific circuit topology. When used in…
Global placement is a fundamental step in VLSI physical design. The wide use of 2D processing element (PE) arrays in machine learning accelerators poses new challenges of scalability and Quality of Results (QoR) for state-of-the-art…
Microwave sensors integrated with microfluidic platforms can provide the size and permittivity of single cells and microparticles. Amongst the microwave sensor topologies, the planar arrangement of electrodes is a popular choice owing to…
The advent of 6G is expected to enable many use cases which may rely on accurate knowledge of the location and orientation of user equipment (UE). The conventional localization methods suffer from limitations such as synchronization and…
Considering that the physical design of printed circuit board (PCB) follows the principle of modularized design, this paper proposes an automatic placement algorithm for functional modules. We first model the placement problem as a…
We derive a mixed-dimensional 3D-1D formulation of the electrostatic equation in two domains with different dielectric constants to compute, with an affordable computational cost, the electric field and potential in the relevant case of…
This paper presents a heuristic approach for solving the placement of Analog and Mixed-Signal Integrated Circuits. Placement is a crucial step in the physical design of integrated circuits. During this step, designers choose the position…
Micro-Electro-Mechanical Systems (MEMS) normally have fixed or moving structures (plates or array of thin beams) with cross-sections of the order of microns and lengths of the order of tens or hundreds of microns. Electrostatic forces play…
We propose a flat nonlinear placement algorithm FFTPL using fast Fourier transform for density equalization. The placement instance is modeled as an electrostatic system with the analogy of density cost to the potential energy. A…
Nowadays nanoscale combinational circuits are facing significant reliability challenges including soft errors and process variations. This paper presents novel process variation-aware placement strategies that include two algorithms to…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…