Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.
Cite
@article{arxiv.2203.06093,
title = {Integration and Packaging},
author = {S. Mazza and R. Lipton and R. Patti and R. Islam},
journal= {arXiv preprint arXiv:2203.06093},
year = {2022}
}