3D System Design: A Case for Building Customized Modular Systems in 3D
Distributed, Parallel, and Cluster Computing
2024-09-17 v1 Emerging Technologies
Abstract
3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the underlying technology continues to evolve, the unique leverages of 3D have become increasingly appealing to a larger range of applications: from embedded mobile applications to servers and memory systems. In this paper we focus on the system-level implications of 3D technology, trying to differentiate the unique advantages that it provides to different market segments and applications.
Cite
@article{arxiv.2409.09068,
title = {3D System Design: A Case for Building Customized Modular Systems in 3D},
author = {Philip Emma and Eren Kurshan},
journal= {arXiv preprint arXiv:2409.09068},
year = {2024}
}