With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic circuit elements unrestricted by layers, offering greater design freedom. Design problems such as floorplanning, transistor sizing, and interconnect sizing are highly complex due to the 3D nature of the circuits and unavoidably require systematic approaches. We introduce geometric programming to solve these design optimization problems systematically and efficiently.
@article{arxiv.2504.01090,
title = {Geometric Programming for 3D Circuits},
author = {Rongbiao Wang and Lek-Heng Lim},
journal= {arXiv preprint arXiv:2504.01090},
year = {2025}
}