Related papers: Geometric Programming for 3D Circuits
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…
The task of establishing correspondences between two 3D shapes is a long-standing challenge in computer vision. While numerous studies address full-full and partial-full 3D shape matching, only a limited number of works have explored the…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
In this paper, we propose an approach to address the problem of classifying 3D industrial components by introducing a novel framework named IC-classifier (Industrial Component classifier). Our framework is designed to focus on the object's…
3D Computer-Aided Design (CAD) users need to overcome several obstacles to benefit from the flexibility of programmatic interface tools. Besides the barriers of any programming language, users face challenges inherent to 3D spatial…
Photonic Integrated Circuits (PICs) provide superior speed, bandwidth, and energy efficiency, making them ideal for communication, sensing, and quantum computing applications. Despite their potential, PIC design workflows and integration…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
In this paper we present some new, practical, geometric optimization techniques for computing polygon partitions, 1D and 2D point, interval, square and rectangle covers, as well as 1D and 2D interval and rectangle K-centers. All the…
We introduce and study conic geometric programs (CGPs), which are convex optimization problems that unify geometric programs (GPs) and conic optimization problems such as semidefinite programs (SDPs). A CGP consists of a linear objective…
Geometric programming (GP) provides a power tool for solving a variety of optimization problems. In the real world, many applications of geometric programming (GP) are engineering design problems in which some of the problem parameters are…
This paper deals with exploiting symmetry for solving linear and integer programming problems. Basic properties of linear representations of finite groups can be used to reduce symmetric linear programming to solving linear programs of…
An approximate formulation of a robust geometric program (RGP) as a convex program is proposed. Interest in using geometric programs (GPs) to model complex engineering systems has been growing, and this has motivated explicitly modeling the…
The majority of microfabricated ion traps in use for quantum information processing are of the 2D 'surface-electrode' type or of the 3D 'wafer' type. Surface-electrode traps greatly simplify fabrication and hold the promise of allowing…
Photonic integrated circuits (PIC) currently rely on application-specific designs that are geared towards a particular functionality. Development of such application-specific PIC requires considerable effort and often involves several…
Microstructures, characterized by intricate structures at the microscopic scale, hold the promise of important disruptions in the field of mechanical engineering due to the superior mechanical properties they offer. One fundamental…
The task of 3D ICs layout design involves the assembly of millions of components taking into account many different requirements and constraints such as topological, wiring or manufacturability ones. It is a NP-hard problem that requires…