Related papers: Geometric Programming for 3D Circuits

3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…

Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency…

The task of crafting procedural programs capable of generating structurally valid 3D shapes easily and intuitively remains an elusive goal in computer vision and graphics. Within the graphics community, generating procedural 3D models has…

Since a building's floorplans are easily accessible, consistent over time, and inherently robust to changes in visual appearance, self-localization within the floorplan has attracted researchers' interest. However, since floorplans are…

For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods,…

We give an explicit geometric way to build mixed-integer programming (MIP) formulations for unions of polyhedra. The construction is simply described in terms of spanning hyperplanes in an r-dimensional linear space. The resulting MIP…

Implicit neural representations have emerged as a powerful tool in learning 3D geometry, offering unparalleled advantages over conventional representations like mesh-based methods. A common type of INR implicitly encodes a shape's boundary…

Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…

We study the construction of programable integrated circuits with the help of disordered Chern insulators (CIs) in this letter. Specifically, the schemes for low dissipation logic devices and connecting wires are proposed. We use the…

A Geometric programming (GP) is a type of mathematical problem characterized by objective and constraint functions that have a special form. Many methods have been developed to solve large scale engineering design GP problems. In this paper…

Photonic waveguides are prime candidates for integrated and parallel photonic interconnects. Such interconnects correspond to large-scale vector matrix products, which are at the heart of neural network computation. However, parallel…

Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools…

Finding correspondences between 3D shapes is a crucial problem in computer vision and graphics, which is for example relevant for tasks like shape interpolation, pose transfer, or texture transfer. An often neglected but essential property…

This paper presents a heuristic approach for solving the placement of Analog and Mixed-Signal Integrated Circuits. Placement is a crucial step in the physical design of integrated circuits. During this step, designers choose the position…

We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…

IC-planar graphs are those graphs that admit a drawing where no two crossed edges share an end-vertex and each edge is crossed at most once. They are a proper subfamily of the 1-planar graphs. Given an embedded IC-planar graph $G$ with $n$…

Constructing general programmable circuits to be able to run any given unitary operator efficiently on a quantum processor is of fundamental importance. We present a new quantum circuit design technique resulting two general programmable…

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…

3D printing is considered the future of production systems and one of the physical elements of the Fourth Industrial Revolution. 3D printing will significantly impact the product lifecycle, considering cost, energy consumption, and carbon…