Related papers: ePlace-3D: Electrostatics based Placement for 3D-I…
We present an all-dielectric metadevice platform realized by combining an inverse electromagnetic design computational method with additive manufacturing. As opposed to conventional flat metasurface based devices that are composed of…
Recent advances in 3D Gaussian Splatting (3DGS) have focused on accelerating optimization while preserving reconstruction quality. However, many proposed methods entangle implementation-level improvements with fundamental algorithmic…
Co-optimizing placement with congestion is integral to achieving high-quality designs. This paper presents GOALPlace, a new learning-based general approach to improving placement congestion by controlling cell density. Our method…
The task of "relative placement" is to predict the placement of one object in relation to another, e.g. placing a mug onto a mug rack. Through explicit object-centric geometric reasoning, recent methods for relative placement have made…
In this work, we present a learning-based approach to chip placement, one of the most complex and time-consuming stages of the chip design process. Unlike prior methods, our approach has the ability to learn from past experience and improve…
A popular approach for 3D source localization using multiple microphones is the steered-response power method, where the source position is directly estimated by maximizing a function of three continuous position variables. Instead of…
In this report, we present the 4th place solution for CVPR 2023 3D occupancy prediction challenge. We propose a simple method called Multi-Scale Occ for occupancy prediction based on lift-splat-shoot framework, which introduces multi-scale…
Although various visual localization approaches exist, such as scene coordinate regression and camera pose regression, these methods often struggle with optimization complexity or limited accuracy. To address these challenges, we explore…
We introduce Cycle-Sync, a robust and global framework for estimating camera poses (both rotations and locations). Our core innovation is a location solver that adapts message-passing least squares (MPLS) -- originally developed for group…
Beam alignment enables efficient, stable transmission and control of optical energy and information, which critically depend on precise monitoring and regulation of the three-dimensional (3D) relative positioning between fibers. This study…
Realizing relative localization by leveraging inter-robot local measurements is a challenging problem, especially in the presence of measurement noise. Motivated by this challenge, in this paper we propose a novel and systematic 3-D…
Based on the Fourier extension, we propose an oversampling collocation method for solving the elliptic partial differential equations with variable coefficients over arbitrary irregular domains. This method only uses the function values on…
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…
The recently developed energy conserving semi-implicit method (ECsim) for PIC simulation is applied to multiple scale problems where the electron-scale physics needs to be only partially retained and the interest is on the macroscopic or…
This article presents proposals for the design of reduced-order controllers for high-dimensional dynamical systems. The objective is to develop efficient control strategies that ensure stability and robustness with reduced computational…
Dataflow is a critical yet underexplored factor in automatic macro placement, which is becoming increasingly important for developing intelligent design automation techniques that minimize reliance on manual adjustments and reduce design…
We introduce a novel frame-interpolation-based method for slice imputation to improve segmentation accuracy for anisotropic 3D medical images, in which the number of slices and their corresponding segmentation labels can be increased…
As the feature size of semiconductor process further scales to sub-16nm technology node, triple patterning lithography (TPL) has been regarded one of the most promising lithography candidates. M1 and contact layers, which are usually…
In this paper, we consider a single-anchor localization system assisted by a reconfigurable intelligent surface (RIS), where the objective is to localize multiple user equipments (UEs) placed in the radiative near-field region of the RIS by…
We investigate how fully-passive electromagnetic skins (EMSs) can be engineered to enhance channel charting (CC) in dense urban environments. We employ two complementary state-of-the-art CC techniques, semi-supervised t-distributed…