Related papers: ePlace-3D: Electrostatics based Placement for 3D-I…
The placement problem in Very Large-Scale Integration (VLSI) circuits is a critical step in chip design. Its primary goal is to optimize the wirelength of circuit components within a confined area while adhering to nonoverlapping…
Complex plasmas consist of microparticles embedded in a low-temperature plasma containing ions, electrons and neutral particles. The microparticles form a dynamical system that can be used to study a multitude of effects on the level of the…
Accurate source localization in Multi-Platform Radar Networks (MPRNs) benefits from exploiting both range and angle measurements under robust estimation. In this paper, we propose a robust Euclidean distance matrix (EDM) optimization model…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
In this communication revolution era, visible light communication (VLC) is the optimum efficacious answer to the increased request for high-speed data transmission with reduced cost, besides the illumination. This technology is considered…
EfficientPose is an impressive 3D object detection model. It has been demonstrated to be quick, scalable, and accurate, especially when considering that it uses only RGB inputs. In this paper we try to improve on EfficientPose by giving it…
Positioning is expected to be a core function in intelligent transportation systems (ITSs) to support communication and location-based services, such as autonomous driving, traffic control, etc. With the advent of low-cost reflective…
As technology advances, photonic integrated circuits (PICs) are rapidly scaling in size and complexity, with modern designs integrating thousands of components. However, the analog custom layout nature of photonics, the curvy waveguide…
This paper presents a robust 6-DoF localization framework based on a direct, CPU-based scan-to-map registration pipeline. The system leverages G-EDF, a novel continuous and memory-efficient 3D distance field representation. The approach…
Over the years, the DRAM latency has not scaled proportionally with its density due to the cost-centric mindset of the DRAM industry. Prior work has shown that this shortcoming can be overcome by reducing the critical length of DRAM access…
When partitioning gate-level netlists using graphs, it is beneficial to cluster gates to reduce the order of the graph and preserve some characteristics of the circuit that the partitioning might degrade. Gate clustering is even more…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
The suboptimal physical design of the integrated circuits may not only increase the manufacturing costs due to the larger size of the chip but can also impact its performance by placing interconnected rectangular devices too far from each…
3D global relocalization is one of the key capabilities for mobile robots in practical applications. However, in large scale spaces, existing methods often suffer from prolonged online relocalization time due to factors such as the massive…
Dense 3D convolutions provide high accuracy for perception but are too computationally expensive for real-time robotic systems. Existing tri-plane methods rely on 2D image features with interpolation, point-wise queries, and implicit MLPs,…
As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alternative to traditional clock-based designs. However, the…
The latest assessments of the emerging technologies for reconfigurable intelligent surfaces (RISs) have indicated the concept's significant potential for localization and sensing, either as individual or simultaneously realized tasks.…
An efficient electro-optical modulation has been demonstrated here by using an edge plasmon mode specific for the hybrid plasmonic waveguide. Our approach addresses a major obstacle of the integrated microwave photonics caused by the…
Non-geostationary (NGSO) satellite communications systems have attracted a lot of attention both from industry and academia, over the past several years. Beam placement is among the major resource allocation problems in multi-beam NGSO…