Related papers: ePlace-3D: Electrostatics based Placement for 3D-I…
Automated placement of components on printed circuit boards (PCBs) is a critical stage in placement layout design. While reinforcement learning (RL) has been successfully applied to system-on-chip IP block placement and chiplet arrangement…
Visible light communication (VLC) based localization is a potential candidate for wide range indoor localization applications. In this paper, we propose a VLC architecture based on orthogonal frequency division multiplexing (OFDM) with…
Localization, or position fixing, is an important problem in robotics research. In this paper, we propose a novel approach for long-term localization in a changing environment using 3D LiDAR. We first create the map of a real environment…
Micro-Electro-Mechanical Systems (MEMS) normally have fixed or moving structures with cross-sections of the order of microns ($\mu m$) and lengths of the order of tens or hundreds of microns. These structures are often plates or array of…
The objective of electrical impedance tomography is to reconstruct the internal conductivity of a physical body based on measurements of current and potential at a finite number of electrodes attached to its boundary. Although the…
The simulation of three dimensional magnetostatic problems plays an important role, for example when simulating synchronous electric machines. Building on prior work that developed a domain decomposition algorithm using isogeometric…
We propose a novel iterative method for optimally placing and orienting multiple cameras in a 3D scene. Sample applications include improving the accuracy of 3D reconstruction, maximizing the covered area for surveillance, or improving the…
Three-dimensional (3D) micro-electromagnets were developed to control particle motion in magnetic field landscapes in vacuum near a chip. Multiple layers of micron-scale conductors separated by transparent insulators create particle…
We consider 3-dimensional (3D) visible light positioning (VLP) based on smartphone camera in an indoor scenario. Based on the positioning model in the quantized pixel-domain, we characterize the 3D normalized positioning error metric (NPEM)…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
In this work, we study coded placement in caching systems where the users have unequal cache sizes and demonstrate its performance advantage. In particular, we propose a caching scheme with coded placement for three-user systems that…
The overarching goals in image-based localization are scale, robustness and speed. In recent years, approaches based on local features and sparse 3D point-cloud models have both dominated the benchmarks and seen successful realworld…
Rod-based structures are commonly used in practical applications in science and engineering. However, in many design, analysis, and manufacturing tasks, handling the rod-based structures in three dimensions directly is generally…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
Current monocular 3D detectors are held back by the limited diversity and scale of real-world datasets. While data augmentation certainly helps, it's particularly difficult to generate realistic scene-aware augmented data for outdoor…
The emergence of real-time 3D ultrasound (US) makes it possible to consider image-based tracking of subcutaneous soft tissue targets for computer guided diagnosis and therapy. We propose a 3D transrectal US based tracking system for precise…
In recent years, deep learning models have become ubiquitous in industry and academia alike. Modern deep neural networks can solve one of the most complex problems today, but coming with the price of massive compute and storage…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
This paper presents a novel system designed for 3D mapping and visual relocalization using 3D Gaussian Splatting. Our proposed method uses LiDAR and camera data to create accurate and visually plausible representations of the environment.…
This paper studies a networked sensing system with multiple base stations (BSs), which collaboratively sense the unknown and random three-dimensional (3D) location of a target based on the target-reflected echo signals received at the BSs.…