Related papers: ePlace-3D: Electrostatics based Placement for 3D-I…
Study of the dephasing in electronic systems is not only important for probing the nature of their ground states, but also crucial to harnessing the quantum coherence for information processing. In contrast to well-studied conventional…
Three-dimensional self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional two-dimensional…
Accurate localization is fundamental to a variety of applications, such as navigation, robotics, autonomous driving, and Augmented Reality (AR). Different from incremental localization, global localization has no drift caused by error…
Coupled 3D-1D problems arise in many practical applications, in an attempt to reduce the computational burden in simulations where cylindrical inclusions with a small section are embedded in a much larger domain. Nonetheless the resolution…
The ability to tune magnetic orders, such as magnetic anisotropy and topological spin texture, is desired in order to achieve high-performance spintronic devices. A recent strategy has been to employ interfacial engineering techniques, such…
Modern multi-core systems have a large number of design parameters, most of which are discrete-valued, and this number is likely to keep increasing as chip complexity rises. Further, the accurate evaluation of a potential design choice is…
Accurate pose estimation and shift correction are key challenges in cryo-EM due to the very low SNR, which directly impacts the fidelity of 3D reconstructions. We present an approach for pose estimation in cryo-EM that leverages…
The dynamics of energetic particle (EP) species, born from fusion reactions or plasma heating schemes, are critical for predicting the behavior of magnetic confinement fusion experiments and future fusion reactors. Because energetic…
The research interest on location-based services has increased during the last years ever since 3D centimetre accuracy inside intelligent environments could be confronted with. This work proposes an indoor local positioning system based on…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
The mixed-size placement benchmarks described in this book chapter directly address several of the shortcomings in previously published suboptimality benchmarks. Two new sets of placement examples are constructed, one targeting the role of…
Given a designer created free-form surface in 3d space, our method computes a grid composed of elastic elements which are completely planar and straight. Only by fixing the ends of the planar elements to appropriate locations, the 2d grid…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
Across many plasma applications, the underlying phenomena and interactions among the involved processes are known to exhibit three-dimensional characteristics. Furthermore, the global properties and evolution of plasma systems are often…
The phasor measurement unit (PMU) placement problem is revisited by taking into account a stronger characterization of the electrical connectedness between various buses in the grid. To facilitate this study, the placement problem is…
When modern FPGA architecture becomes increasingly complicated, modern FPGA placement is a mixed optimization problem with multiple objectives, including wirelength, routability, timing closure, and clock feasibility. Typical FPGA devices…
3D instance segmentation plays a crucial role in comprehending 3D scenes. Despite recent advancements in this field, existing approaches exhibit certain limitations. These methods often rely on fixed instance positions obtained from sampled…
We propose a method to non-rigidly align a three-dimensional (3D) volumetric image with a two-dimensional (2D) planar image representing a projection of the deformed volume. The application in mind comes from biological studies in which 2D…
Recent advances in ferroelectrics highlight the role of three-dimensional (3D) polar entities in forming topological polar textures and generating giant electromechanical responses, during polarization rotation. However, current electron…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…