相关论文: High Density Hybridisation Using ENIG Bumping and …
A hybrid pixel detector based on the concept of simultaneous charge integration and photon counting will be presented. The second generation of a counting and integrating X-ray prototype CMOS chip (CIX) has been operated with different…
Electrical excitation of light using inelastic electron tunneling is a promising approach for the realization of ultra-compact on-chip optical sources with high modulation bandwidth. However, the practical implementation of these nanoscale…
Silver benzeneselenolate [AgSePh] is a coordination polymer that hosts a hybrid quantum well structure. The recent advancements in the study of its tightly bound excitons (~300 meV) and photoconductive properties (recently employed in UV…
A novel fully-connected (FC) tri-hybrid beamforming (THB) architecture is proposed for pinching antenna systems (PASS). In contrast to conventional sub-connected (SC) PASS, the proposed FC architecture employs a tunable phase-shifter…
This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE…
With the development of quantum technology, hybrid devices that combine superconductors (S) and semiconductors (Sm) have attracted great attention due to the possibility of engineering structures that benefit from the integration of the…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
Entropy coding is widely used in typical learned image compression (LIC) that converts latents into a compact bitstream. However, entropy coding is typically sequential and becomes the coding latency bottleneck. To overcome it, we present…
Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform…
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…
Optimization of an area detector involves compromises between various parameters like frame rate, read noise, dynamic range and pixel size. We have implemented and tested a novel front-end binning design in a photon-integrating hybrid pixel…
Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the reduced costs. Such technology is especially appealing when…
Integrated Sensing and Communication (ISAC) requires the development of a waveform capable of efficiently supporting both communication and sensing functionalities. This paper proposes a novel waveform that combines the benefits of both the…
Edge computing is a promising solution for handling high-dimensional, multispectral analog data from sensors and IoT devices for applications such as autonomous drones. However, edge devices' limited storage and computing resources make it…
In remote sensing, each sensor can provide complementary or reinforcing information. It is valuable to fuse outputs from multiple sensors to boost overall performance. Previous supervised fusion methods often require accurate labels for…
We present a programmable 16 channel, mixed signal, low power readout ASIC, having the project historically named Gigasample Recorder of Analog waveforms from a PHotodetector (GRAPH). It is designed to read large aperture single photon…
We investigate the structural, electronic, and superconducting properties of a hexagonal BP3 monolayer using first-principles calculations combined with anisotropic Migdal-Eliashberg theory. The optimized structure exhibits a stable,…
There are a large number of atomically thin graphitic films with similar structure to graphene. These films have a spread of bandgaps relating to their ionicity, and also to the substrate on which they are grown. Such films could have a…
Solving the electroencephalography (EEG) forward problem is a fundamental step in a wide range of applications including biomedical imaging techniques based on inverse source localization. State-of-the-art electromagnetic solvers resort to…
Fiber-to-chip couplers play a crucial role in interfacing on-chip photonic circuits with other optical systems or off-chip devices. Downsizing the couplers via topology optimization addresses the demand for high-density integration and…