相关论文: Leveraging 3D Technologies for Hardware Security: …

The increasing cost of integrated circuit (IC) fabrication has driven most companies to "go fabless" over time. The corresponding outsourcing trend gave rise to various attack vectors, e.g., illegal overproduction of ICs, piracy of the…

3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the…

Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…

To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…

Printer fingerprinting techniques have long played a critical role in forensic applications, including the tracking of counterfeiters and the safeguarding of confidential information. The rise of 3D printing technology introduces…

The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…

Due to cost benefits, supply chains of integrated circuits (ICs) are largely outsourced nowadays. However, passing ICs through various third-party providers gives rise to many threats, like piracy of IC intellectual property or insertion of…

Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…

Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to disclose the activities of key functional blocks and even…

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…

With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…

The widespread accessibility and ease of use of additive manufacturing (AM), widely recognized as 3D printing, has put Intellectual Property (IP) at great risk of theft. As 3D printers emit acoustic and magnetic signals while printing, the…

The central security issue of outsourced 3D printing (aka AM: Additive Manufacturing), an industry that is expected to dominate manufacturing, is the protection of the digital design (containing the designers' model, which is their…

Over the years, many techniques have been introduced to protect integrated circuits (ICs) from hardware security threats that emerged in the globalized IC manufacturing supply chain, such as overproduction and piracy. However, most of these…

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…

To reduce the cost of ICs and to meet the market's demand, a considerable portion of manufacturing supply chain, including silicon fabrication, packaging and testing may be pushed offshore. Utilizing a global IC manufacturing supply chain,…

3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…

Today, many organizations are moving their computing services towards the Cloud. This makes their computer processing available much more conveniently to users. However, it also brings new security threats and challenges about safety and…

Design and manufacturing of integrated circuits predominantly use a globally distributed semiconductor supply chain involving diverse entities. The modern semiconductor supply chain has been designed to boost production efficiency, but is…

Split manufacturing is a promising technique to defend against fab-based malicious activities such as IP piracy, overbuilding, and insertion of hardware Trojans. However, a network flow-based proximity attack, proposed by Wang et al.…