相关论文: ProForm: Solder-Free Circuit Assembly Using Thermo…
The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to…
Electronics are integral to modern life; however, at their end-of-life these devices produce environmentally hazardous electronic waste (e-waste). Recycling the ubiquitous printed circuit boards (PCBs) that make up a substantial mass and…
Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. Vacuum-forming is ubiquitous in packaging and casing products in…
The disposal and recycling of electronic waste (e-waste) is a global challenge. The disassembly of components is a crucial step towards an efficient recycling process, avoiding the destructive methods. Although most disassembly work is…
Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic filaments. Because of their high resistance and difficulties in printing traces in vertical…
For today's electronics manufacturing process, the emphasis on stable functionality, durability, and fixed physical forms is designed to ensure long-term usability. However, this focus on robustness and permanence complicates the…
A phase field method self-consistently coupled to continuum heat transport and charge conservation is used to simulate conducting filament dynamical evolution and nanostructure of electroformed resistive switching thin films. Our method…
Quality of the electrical contacts and interfaces in various metal/semiconductor/insulator heterostructures is one of the pivotal aspects in both applied and fundamental research areas. For instance, non-optimal contact resistance can limit…
Continuum solvation models are becoming increasingly relevant in condensed matter simulations, allowing to characterize materials interfaces in the presence of wet electrified environments at a reduced computational cost with respect to all…
We introduce DissolvPCB, an electronic prototyping technique for fabricating fully recyclable printed circuit board assemblies (PCBAs) using affordable FDM 3D printing, with polyvinyl alcohol (PVA) as a water-soluble substrate and eutectic…
The rapid growth of electronic waste must be curtailed to prevent accumulation of environmentally and biologically toxic materials, which are essential to traditional electronics. The recent proliferation of transient electronics has…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…
Electronics prototyping using breakout boards allows designers with and without an engineering background to rapidly create interactive prototypes. However, when it comes to transition to a production-ready PCB design, stagnation exists due…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
The need for higher power density in electrical machines require better cooling strategies. Spray cooling is a very promising and relatively simple technology to apply, but involves extremely complicated physics. In this paper, a quasi-3D…
We propose a new paradigm of electronic devices based only on two electrodes separated by a gap, i.e. without any functional element bridging them. We use a tight-binding model to show that, depending on the type of material of the…
Forced convection cooling is important in numerous technologies ranging from microprocessors in data centers to turbines and engines; active cooling is essential in these situations. However, active transfer of heat or thermal energy under…
By converting waste heat into electricity through the thermoelectric power of solids without producing greenhouse gas emissions, thermoelectric generators could be an important part of the solution to today's energy challenge. There has…
The current fabrication and assembly of fluidic circuits for soft robots relies heavily on manual processes; as the complexity of fluidic circuits increases, manual assembly becomes increasingly arduous, error-prone, and timeconsuming. We…
Superconducting circuits are a promising platform for implementing fault-tolerant quantum computers, quantum limited amplifiers, ultra-low power superconducting electronics, and sensors with ultimate sensitivity. Typically, circuit…