相关论文: ProForm: Solder-Free Circuit Assembly Using Thermo…
The full-wave simulation of complex electromagnetic surfaces such as reflectarrays and metasurfaces is a challenging problem. In this paper, we present a macromodeling approach to efficiently simulate complex electromagnetic surfaces…
The impressive performance of transformer models has sparked the deployment of intelligent applications on resource-constrained edge devices. However, ensuring high-quality service for real-time edge systems is a significant challenge due…
We present, SurfCuit, a novel approach to design and construction of electric circuits on the surface of 3D prints. Our surface mounting technique allows durable construction of circuits on the surface of 3D prints. SurfCuit does not…
Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cost cannot be met by silicon-based computing. Built on…
Porous flow-through electrodes are used as the core reactive component across electrochemical technologies. Controlling the fluid flow, species transport, and reactive environment is critical to attaining high performance. However,…
Electron tomography has become a commonly used tool to investigate the three-dimensional (3D) structure of nanomaterials, including colloidal nanoparticle assemblies. However, electron microscopy is typically carried out under high vacuum…
Thermoelectric materials, which can convert waste heat into electricity or act as solid-state Peltier coolers, are emerging as key technologies to address global energy shortages and environmental sustainability. However, discovering…
Extended from its electromagnetic counterpart, transformation thermodynamics applied to thermal conduction equations can map a virtual geometry into a physical thermal medium, realizing the manipulation of heat flux with almost arbitrarily…
Efficient thermal management in high-power electronics cooling can be achieved using phase-change heat transfer devices, such as vapor chambers. Traditional vapor chambers use wicks to transport condensate for efficient thermal exchange and…
The waste of electrical and electronic equipment has been increased due to the fast evolution of technology products and competition of many IT sectors. Every year millions of tons of electronic waste are thrown into the environment which…
Electron beams can acquire designed phase modulations by passing through nanostructured material phase plates. These phase modulations enable electron wavefront shaping and benefit electron microscopy, spectroscopy, lithography, and…
A direct electronics printing technique through atomized spraying for patterning room temperature liquid metal droplets on desired substrate surfaces is proposed and experimentally demonstrated for the first time. This method has…
The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being explored,…
Flexible sensors are increasingly employed in soft robotics and wearable devices to provide proprioception of freeform deformations.Although supervised learning can train shape predictors from sensor signals, prediction accuracy strongly…
Despite advances in soft, sticker_like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco friendly conductive ink for thin_film circuitry composed of silver flakes and a…
This paper introduces a new method of paper circuit fabrication that overcomes design barriers and increases flexibility in circuit design. Conventional circuit boards rely on thin traces, which limits the complexity and accuracy when…
Electrodeposition is a fundamental process in electrochemistry, and has applications in numerous industries, such as corrosion protection, decorative finishing, energy storage, catalysis, and electronics. While there is a long history of…
Modeling and analysis of soft errors in electronic circuits has traditionally been done using computer simulations. Computer simulations cannot guarantee correctness of analysis because they utilize approximate real number representations…
The present work addresses the simulation of pore emptying during the drying of battery electrodes. For this purpose, a model based on the multiphase-field method (MPF) is used, since it is an established approach for modeling and…
Patterning the wettability of solid surfaces is a successful strategy to control the dropwise condensation of vapor onto partially wetting solid surfaces. We followed the condensation of water vapor onto electrowetting-functionalized…